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System For Supplying Unmelted Hot Melt Adhesive Pieces

A technology of supply system and hot melt adhesive, which is applied to the device, container, transportation and packaging of the surface coating liquid, which can solve the problems of sticking together and rising

Active Publication Date: 2017-12-08
NORDSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, globs or large formations of hot melt tend to cause nearby lumps of hot melt to stick to it, and this process can lead to considerable formation in the glue supply
[0009] In addition to the elevated temperature, the amount of time the hot melt stick stays in the glue supply can also cause problems when moving the hot melt stick to the melter
If the hot melt sticks stay in the glue supply longer, they may start to stick together, causing problems similar to those described above

Method used

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  • System For Supplying Unmelted Hot Melt Adhesive Pieces
  • System For Supplying Unmelted Hot Melt Adhesive Pieces
  • System For Supplying Unmelted Hot Melt Adhesive Pieces

Examples

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Embodiment Construction

[0027] figure 1 with 2 An illustrative hot melt adhesive supply system 10 (hereinafter "supply system") is shown. In general, supply system 10 is configured to receive a supply of hot melt adhesive gobs, and to provide hot melt adhesive gobs in a controlled manner to an attached glue melter. The glue melter can then provide molten hot melt glue to the glue dispensing module.

[0028] The hot melt adhesive supply system 10 may include a rigid outer container 12 . In some aspects, outer container 12 may be formed from a plastic box that was originally intended to contain waste. The outer container 12 may comprise an upper cavity 14 initially receiving a supply of hot melt adhesive, and a lower cavity 16 from which the hot melt adhesive is delivered via a transfer member 72 to an attached glue melter. . The upper cavity 14 may be defined by an upper receptacle 88 . A dispensing mechanism 20 may be disposed between the upper cavity 14 and the lower cavity 16 to facilitate co...

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PUM

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Abstract

A hot melt adhesive supply system is disclosed. The hot melt adhesive supply system includes an outer container defining an upper cavity and a lower cavity. The upper cavity includes an inner container having a top opening to receive unmelted hot melt adhesive pieces and a bottom aperture. The system also includes a dispensing mechanism between the upper cavity and the lower cavity. The dispensing mechanism regulates the dispensing of the unmelted hot melt adhesive pieces from the upper cavity to the lower cavity. The dispensing mechanism includes a base plate and one or more rotating members that rotate to move the unmelted hot melt adhesive pieces through a gap defined between the base plate and the bottom aperture. The system also includes a transfer conduit that communicates the unmelted hot melt adhesive pieces from the lower cavity to a hot melt adhesive melter.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of US Provisional Patent Application No. 62 / 329,158, filed April 28, 2016, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0003] The present disclosure relates generally to hot melt adhesive systems, and more particularly to systems for supplying unmelted hot melt adhesive gobs to hot melt adhesive melters. Background technique [0004] Hot melt adhesive systems have many applications in manufacturing and packaging. For example, thermoplastic hot melts are used for carton sealing, casing sealing, tray forming, pallet stabilization, nonwoven applications including diaper manufacturing, and many others. Hot melt glue is usually in the form of pellets or granules, usually called nuggets, and is contained in and supplied from a glue supply, such as a bin or hopper. The hot melt adhesive block can be heated and melted by a hot melt adhesiv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65G65/48B65G69/14B65D88/66B65D88/64
CPCB65D88/64B65D88/66B65G65/4818B65G69/14B05C11/1042B05C11/101B05C11/11B65G53/00B05C5/001B65D25/02B65D43/163
Inventor 埃内斯·雷默瑟瓦茨
Owner NORDSON CORP
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