Baking device for curing SMD LED glue and method thereof

Abstract

The invention relates to the technical field of baking of LED and particularly relates to a baking device for curing SMD LED glue and a method thereof. The baking device is simple in structure, high in using efficiency and flexible to operate, and is capable of baking a large number of LED lamps in one time; a removable baking frame is arranged on a feeding component; LED lamps to be baked are directly mounted on the baking frame outside a baking oven; clamping jaws of a square fixed disc are matched with clamping blocks of the braking frame in use, so that the operating efficiency is greatly improved; the baking frame carrying LEDs is directly carried into the baking oven or taken out of the baking oven by a machine, and then a next baking frame is put in the baking oven, so that the energy utilization rate and the baking efficiency are improved; the motor drives the baking frame on the square fixed disc to slowly rotate; when the baking device is used in the later period of baking, the stability of the quality of LEDs can be improved; through the method for baking SMD LED chips by using the baking device for curing SMD LED glue, the fluorescent powder sediment is more uniformly distributed; the color consistency is higher; the scattered property of luminance is slow; compared with the luminous flux of the conventional process, the luminous flux of the method is increased by about 3%.

Description

technical field [0001] The invention relates to the technical field of LED baking, in particular to a baking device and method for curing SMD LED glue. Background technique [0002] At present, the oven body of LED baking equipment is usually fixed on the workbench, which is not flexible and inconvenient to use. Putting the LED in a small space, due to the separation of multiple partitions, it is easy to cause the uneven distribution of the hot air source for baking, so that the quality of the product is not stable enough when the LED is packaged, and there is a large difference. The baked LEDs need to be put into the oven one by one. The labor intensity of the technicians is high, which reduces the work efficiency. A process of structural cured products. In this process, due to the difference in the particle size of the phosphor powder added, there are inconsistencies in the precipitation and distribution of the phosphor powder, which will affect the consistency of the col...

AI Technical Summary

Problems solved by technology

[0002] At present, the oven body of LED baking equipment is usually fixed on the workbench, which is not flexible and inconvenient to use. Putting the LED in a small space, due to the separation of multiple partitions, it is easy to cause the uneven distribution of the hot air source for baking, so that the quality of the product is not stable enough when the LED is packaged, and there is a large difference. The baked LEDs need to be put into the oven one by one. The labor intensity of the technicians is high, which reduces the work efficiency. A process of structural cured products. In this process, due to the difference in the particle size of the phosphor powder added, there are inconsistencies in the precipitation and distribution of the phosphor powder, which will affect the consistency of the color, and the brightness will be scattered.

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