Adhesive packaging method of light emitting diode chip

Abstract

A method for encapsulating LED chips, comprising: providing a first forming mold with a first mold cavity; filling a first encapsulant into the first mold cavity; placing the LED chip into the first mold cavity, Encapsulating the LED chip with the first encapsulation material, wherein the active surface of the LED chip is facing outward and not covered by the first encapsulation material; and curing the first encapsulation material to form a first encapsulation finished product. Accordingly, the present invention can directly coat the light-emitting diode chip with a packaging material such as fluorescent glue or transparent glue, so as to save the main part of the package such as the lead frame / substrate, which is beneficial to thinner design.

Description

technical field [0001] The invention relates to a glue sealing method for a light emitting diode chip, in particular to a glue sealing method suitable for forming a fluorescent layer and / or a lens on the light emitting diode chip. Background technique [0002] Compared with traditional light sources, light-emitting diodes (LEDs) have the advantages of power saving, small size, and no heat radiation. Therefore, in recent years, light-emitting diodes have gradually replaced traditional light sources. However, most light-emitting diodes are red, yellow, green, and blue light sources. Therefore, in order to meet the needs of various light colors, LED chips with different colors or coated with a fluorescent layer on the outer layer of the LED are generally used to make use of mixed light. to produce the desired shade. [0003] In the prior art LED production process, the LED wafer can be cut into single LED chips first, then the LED chips are fixed on the substrate or lead frame...

AI Technical Summary

Problems solved by technology

Most of the traditional manufacturing process is to form the lens after the LED chip is connected on the substrate or lead frame, and finally cut into a single package. Therefore, the finished product also has the disadvantage that the main part of the package cannot be omitted. In addition, the lens is generally It is formed by injecting transparent glue into the mold cavity between the upper mold and the lower mold to cover the LED chip, and then curing it. However, the mold cavity and injection port are formed separately in the upper and lower molds, which will lead to complex mold making and high cost. Disadvantages such as expensive, and the side of the lens may form a cut vertical wall due to the cutting step

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