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Electronic paste, preparation method thereof, thick-film circuit chip hot source and preparation method of thick-film circuit chip hot source

A technology of electronic paste and thick film circuit, which is applied in the direction of electric heating devices, ohmic resistance heating, electrical components, etc., can solve the problems that the application requirements of special electronic paste are difficult to meet, and achieve the effect of high production efficiency and good manufacturability

Pending Publication Date: 2017-11-24
王晨
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

That is to say, our country is still unable to meet the application requirements of general-purpose electronic paste, and it is even more difficult to meet the application requirements of special-purpose electronic paste.

Method used

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  • Electronic paste, preparation method thereof, thick-film circuit chip hot source and preparation method of thick-film circuit chip hot source
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  • Electronic paste, preparation method thereof, thick-film circuit chip hot source and preparation method of thick-film circuit chip hot source

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Embodiment Construction

[0080] In order to better explain the present invention and facilitate understanding, the present invention will be described in detail below through specific embodiments in conjunction with the accompanying drawings.

[0081] The electronic paste for preparing thick film circuits according to the embodiment of the present invention includes a solid phase component and an organic solvent carrier; wherein, the weight ratio of the solid phase component to the organic solvent carrier is 65-90:35-10, and the solid phase The components comprise graphene or graphene oxide and at least one rare earth oxide.

[0082] The electronic paste for preparing thick-film circuits in the embodiment of the present invention disperses a small amount of graphene or graphene-like particles into the thick-film circuit layer and the thick-film dielectric layer, and the carbon formed in the thick-film circuit layer and the thick-film dielectric layer The fine mesh of micro-nano materials improves the ...

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Abstract

The invention relates to electronic paste for preparing a thick-film circuit. The electronic paste comprises a solid-phase constituent and an organic solvent carrier, wherein the weight ratio of the solid-phase constituent and the organic solvent is (65-90):(35-10), and the solid-phase constituent comprises graphene or the graphene and at least one rare-earth oxide. In the electronic paste for preparing the thick-film circuit, provided by the invention, a tiny amount of graphene or graphene particles are dispersed in a thick-film circuit layer and a thick-film dielectric layer, the electrical property, the thermal performance and the chemical performance of the thick-film circuit and the heat conductivity of a thermal interface in a thickness direction are improved at orders of magnitude by the micro fine lattices of the formed carbon micronano material, and the heat dissipation performance and the mechanical strength of a large-power thick-film integrated circuit are substantially improved.

Description

technical field [0001] The invention relates to an electronic paste for preparing a high-power thick-film integrated circuit, in particular to an electronic paste for preparing a heat source of a thick-film circuit chip. Background technique [0002] In the field of intelligent electric heat sources, electronic pastes for thick film circuits are usually divided into low-temperature electronic pastes: 65-250°C, medium-temperature electronic pastes: 250-600°C and high-temperature electronic pastes: 600-1200°C. The high-temperature heat source 600-1200 ℃ thick film circuit is the high-end level of intelligent heat source technology. Low-temperature heat sources have a wide range of applications, medium-temperature heat sources are not used frequently, and high-temperature heat sources are mostly used for special applications due to their complex technology and difficulty. [0003] Despite the rapid development of my country's general-purpose electronic pastes in the past ten y...

Claims

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Application Information

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IPC IPC(8): H05B3/10H05B3/22
CPCH05B3/10H05B3/22H05B2203/013H05B2203/017
Inventor 王克政王晨
Owner 王晨
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