Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preparation method of zero shrinkage LTCC multi-layer ceramic substrate

A technology of multilayer ceramics and porous ceramics, which is applied in the preparation of zero-shrinkage LTCC multilayer ceramic substrates in the plane X\Y direction, and in the field of preparation of zero-shrinkage LTCC multilayer ceramic substrates, which can solve the difficulty of consistency control and shrinkage control. Poor precision, high material cost and other problems, to achieve the effect of loose material and equipment performance requirements, solve thermal uniformity, and simple preparation process

Active Publication Date: 2017-10-20
48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
View PDF5 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The pressure-assisted sintering method is simple, but it has very high requirements on the equipment, it is difficult to control the consistency, and it is prone to problems such as cracking, sticking, and wrinkling.
The patents of pressureless assisted sintering method, self-constrained sintering method and composite co-sintering method are controlled by several large companies, the material cost is high, the price is expensive, and the shrinkage rate control accuracy is poor

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method of zero shrinkage LTCC multi-layer ceramic substrate
  • Preparation method of zero shrinkage LTCC multi-layer ceramic substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A preparation method of a zero-shrinkage LTCC multilayer ceramic substrate of the present invention, such as figure 1 shown, including the following steps:

[0034] (1) Prepare dupont 951 LTCC raw ceramic sheets, and perform the pre-processing operations of punching, printing, and positioning.

[0035] (2) Cut the LTCC green ceramic sheet 5 obtained by the previous process operation into small pieces of 70mm×70mm, stack the small pieces in turn into 10 layers, and then place two 0.1mm thick AlN ceramic green sheets on the upper and lower sides of the stack. Put one layer, and heat-press for 2 hours at a temperature of 80°C and a pressure of 15 MPa to form a green porcelain body.

[0036] (3) First place a porous ceramic pressing plate 3 isolation layer on the upper and lower surfaces of the green porcelain body, and then place a porous silicon carbide pressing plate 2 on the upper and lower surfaces of the porous ceramic pressing plate 3 holding the green porcelain bod...

Embodiment 2

[0042] A preparation method of a zero-shrinkage LTCC multilayer ceramic substrate of the present invention, such as figure 1 shown, including the following steps:

[0043] (1) Prepare the Ferro A6 LTCC green ceramic sheet, and carry out the pre-processing work of punching, printing and positioning.

[0044] (2) Cut the green ceramic sheet obtained in step (1) into small pieces of 70mm×70mm, and stack them sequentially in 20 layers, and then put two 0.1mm thick AlN ceramic green sheets on the top and bottom of the stack, and place them on the The temperature is 90°C, and the pressure is 20MPa, and the hot pressing is carried out for 1 hour to form a green porcelain body.

[0045] (3) First place a porous ceramic press plate 3 on the upper and lower surfaces of the green porcelain body, and then place a porous silicon carbide press plate 2 on the upper and lower surfaces of the porous ceramic press plate 3 holding the green porcelain body, and place under pressure on the devic...

Embodiment 3

[0051] A preparation method of a zero-shrinkage LTCC multilayer ceramic substrate of the present invention comprises the following steps:

[0052] (1) Prepare the dupont 951 LTCC green ceramic sheet, and carry out the pre-processing work of punching, printing and positioning.

[0053] (2) Cut the green ceramic sheet obtained in step (1) into small pieces of 70mm×70mm, stack them in sequence with 10 layers, and then put two pieces of 0.1mm thick Al 2 o 3 Ceramic green porcelain sheets are placed on the upper and lower layers of the laminate, and hot-pressed at a temperature of 100°C and a pressure of 15MPa for 1 hour to form a green porcelain body.

[0054] (3) First place a porous ceramic press plate 3 on the upper and lower surfaces of the green porcelain body, and then place a porous silicon carbide press plate 2 on the upper and lower surfaces of the porous ceramic press plate 3 holding the green porcelain body, and place under pressure on the device.

[0055] (4) Start ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a preparation method of a zero shrinkage LTCC multi-layer ceramic substrate. The preparation method comprises the following steps: preparing a green ceramic body through laminating, sequentially placing one porous ceramic pressing plate and one porous silicon carbide pressing plate on the upper surface and the lower surface of the green ceramic body, putting into a pressure device, firstly heating up and discharging rubber, then heating up and sintering while pressure-assisted sintering is adopted, and then removing surface covering, so that the zero shrinkage LTCC multilayer ceramic substrate is obtained. The preparation method disclosed by the invention is simple and practicable and low in cost, shrinkage consistency of products can be effectively controlled, and shrinkage inter-chip repeatability can be controlled to be minus or plus 0.05%.

Description

technical field [0001] The invention belongs to the field of microelectronic packaging, and relates to a preparation method of a zero-shrinkage LTCC multilayer ceramic substrate, in particular to a preparation method of a zero-shrinkage LTCC multilayer ceramic substrate in plane X\Y directions. Background technique [0002] Due to the unique advantages of LTCC (low temperature co-fired ceramics) technology, LTCC technology has developed rapidly in recent years and is increasingly used in military, aerospace, aviation, electronics, computers, automobiles, medical and other fields. However, as the requirements for large circuit size and high-density integration performance continue to increase, the inherent shrinkage of ordinary LTCC substrates during sintering affects the accuracy of substrate assembly, which can no longer meet the reliability requirements of electronic products. Generally, the shrinkage of the plane size of LTCC raw porcelain materials after co-firing is 12%...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C04B35/638C04B35/645B32B18/00B32B37/10B32B37/06
CPCB32B18/00B32B37/06B32B37/10C04B35/638C04B35/645C04B2235/6562C04B2235/6567
Inventor 杨金邓斌万喜新周水清王学仕陈庆广何永平
Owner 48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com