Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preparation method of hollow micro-channel structure

A micro-channel structure and micro-channel technology, applied in the application field, can solve problems such as high cost, high process requirements, and difficulty in controlling the size of the micro-channel, and achieve the effects of low production cost, large application prospects, and easy and precise control

Active Publication Date: 2017-09-19
LUDONG UNIVERSITY
View PDF6 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention can solve the problems of the existing method for preparing hollow microchannels, such as high technical requirements, difficulty in controlling the size of microchannels, high cost, etc., and provides a novel preparation method for hollow microchannel structures

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method of hollow micro-channel structure

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach

[0014] Specific embodiments: a method for preparing a hollow microchannel structure, which is completed by the following steps:

[0015] Step 1. Preparation of the microchannel master. Clean the used substrate and spin-coat photoresist on it; after standing for ten minutes, place it on a 65°C hot plate and heat it for 10 minutes, then move to 95°C Heating on a hot plate for 30 minutes; then the photoresist mask plate with strip-shaped micron pattern is closely contacted with the photoresist coating, and the photolithography exposure is carried out; the exposed substrate can be developed to obtain the mask. Elongated micro-square structure with the same size as the opaque part of the stencil pattern; place this microstructure on a hot plate, slowly heat up to 140°C, take it off after heating for 30 minutes, and let it cool naturally to room temperature; at 140°C The photoresist is already in a molten state, and it flows under the action of surface tension and gravity, and the c...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a preparation method of a hollow micro-channel structure, and specifically relates to the field of micro machining. The method comprises the following steps: making a micron-sized micro-channel master mask by a photoetching technology and a hot reflux technology; making a PDMS (Polydimethylsiloxane) flexible template by using the master mask, wherein the obtained flexible substrate has a pattern structure complementary to the micro-channel master mask; tightly attaching the PDMS flexible template to the surface of a chip to form a micro-channel cavity; dripping S1813 photoresist on one side; filling the micro-channel cavity with the photoresist under the action of capillary force; heating after filling for a long time, wherein the photoresist in the micro-channel cavity reflows, so that the photoresist in contact with an inner wall of the micro-channel cavity is attached to the inner wall; cooling, curing and removing the PDMS flexible template to obtain the hollow micro-channel structure on the surface of the chip. Compared with other methods for preparing a hollow micro-channel, the preparation method disclosed by the invention has the advantages of low cost, simple process and the like. The preparation method is suitable for the application fields of micro machining, micro-fluidic chips, biomedicine and the like.

Description

technical field [0001] The invention relates to application fields such as micromachining, microfluidic chips, and biomedicine, and in particular to a method for preparing a hollow microchannel structure. Background technique [0002] People's research on channels has already developed from the initial pipes and various coils to various radiator channels and cavities simulating the living environment of cells, and correspondingly, its size ranges from meters, millimeters, to microns . With the development of micro-processing technology, since the 1950s and 1960s, scientists have begun to apply micro-channels to various heat exchangers, reactors, and medically simulate the circulation of blood in human blood vessels. [0003] Capillarity is a common physical phenomenon in nature. It is well known that surface tension will be generated when a liquid contacts the surface of an object. Under the action of this surface tension, the liquid will move along the contact surface. If...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B81C1/00
CPCB81C1/00071B81C1/00119B81C1/00388B81C1/00523B81C2201/0156
Inventor 张登英刘鑫李自万袁慧敏李宏光赵风周张立春曲崇
Owner LUDONG UNIVERSITY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com