Mesophase pitch-based graphite fiber/polypropylene composite material and preparation method thereof

Abstract

The invention discloses a mesophase pitch-based graphite fiber / polypropylene composite material and a preparation method thereof. The mesophase pitch-based graphite fiber / polypropylene composite material is prepared from the following components in parts by weight: 55-75 parts of polypropylene, 2-6 parts of mesophase pitch-based graphite fiber, 5-10 parts of boron nitride, 0.5 part of a coupling agent, 4 parts of maleic anhydride-grafted polypropylene, 5-7 parts of a compatilizer, 5-8 parts of nano-magnesium hydroxide, 2-6 parts of a flexibilizer and 2 parts of other assistants. Polypropylene is modified through selecting the mesophase pitch-based graphite fiber and compounded with the related flexibilizer, coupling agent, compatilizer, fire retardant and lubricant, and the mesophase pitch-based graphite fiber / polypropylene composite material is prepared through a blending mode, so that the heat-conducting property and the flame retardant property are very excellent, a heat-conducting filler and matrix resin are good in compatibility and good in mechanical properties, and furthermore, the machining process is relatively simple.

Description

technical field [0001] The invention belongs to the technical field of composite materials, and in particular relates to a mesophase pitch-based graphite fiber / polypropylene composite material with excellent thermal conductivity and flame retardancy and a preparation method thereof. Background technique [0002] With the development of miniaturization, miniaturization and multi-functionalization of electronic products, the degree of integration of electronic components is getting higher and higher, and the requirements for the heat dissipation performance of their materials are also getting higher and higher. However, the polymer materials commonly used in electronic components have poor thermal conductivity, which can no longer meet the needs of further development of electronic products. [0003] Thermally conductive polymer composite materials have unparalleled thermal conductivity of general polymer materials, and compared with traditional inorganic thermally conductive ...

AI Technical Summary

Problems solved by technology

[0011] (1) The filling ratio of the thermally conductive filler in the formula is large, and more filler systems will reduce the impact performance of the material, making the mechanical properties unable to meet the requirements of use, such as patent CN103819903A, patent CN106046550A, patent CN105647015A, patent CN105820402A

[0012] (2) The thermally conductive filler selected in the formula is a metal filler. The addition of excess metal makes the thermal conductivity not high, making the application range smaller and not suitable for thermally conductive electrical components, such as patent CN102046713A

[0013] (3) The dispersion performance of the thermally conductive filler and the resin matrix selected in the formula is not good, so the thermal conductivity of the composite material is not high, which cannot meet the heat dissipation requirements of the product, such as the patent CN105623258A

[0014] (4) The flame retardant performance of some of the above patents is not good, such as patent CN103819903A, patent CN106046550A, there are potential safety hazards during use

Images