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Low-foam water-based diamond wire cutting liquid

A technology of cutting fluid and water soaking, which is applied in the petroleum industry, lubricating compositions, etc., and can solve problems such as fine powder agglomeration, edge defects, and line marks

Inactive Publication Date: 2017-08-04
ZHENJIANG RENDE NEW ENERGY TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Otherwise, it will cause the fine powder to agglomerate, the wettability of the foaming part will be reduced, and eventually lead to problems such as edge defects and line marks.

Method used

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  • Low-foam water-based diamond wire cutting liquid

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Low-foaming polyether, using propylene glycol or propylene glycol as the initiator, and then completes the addition polymerization with ethylene oxide, the molecular weight is about 2500, EO accounts for 70%, and the proportion is 8%;

[0025] Polyether-modified polysiloxane, the molecular weight of silicone oil is 100,000, the molecular weight of polyether is 500, and the content of EO is 30%, accounting for 5%;

[0026] The emulsifier uses isomeric tridecanol polyoxyethylene ether and isooctyl alcohol polyoxyethylene ether mixed in a ratio of 2:3, accounting for 5%;

[0027] The pH regulator is triethanolamine, adjusted to pH 6.5-7;

[0028] The complexing agent is sodium gluconate, accounting for 2%;

[0029] The extrusion agent is preferably sodium silicate, accounting for 0.2%-1.5%;

[0030] Water 70% ~ 95%.

Embodiment 2

[0032] Low-foaming polyether, using propylene glycol or propylene glycol as the initiator, and then completes the addition polymerization with ethylene oxide, the molecular weight is about 2360, EO accounts for 65%, accounting for 5%;

[0033] Polyether-modified polysiloxane, which is synthesized from silicone oil with a hydrogen content of about 1.5%, and a molecular weight of 2000 polyether, with a ratio of about 4%;

[0034] The emulsifier uses isomeric decanol polyoxyethylene ether, isomeric tridecyl alcohol polyoxyethylene ether, and isooctanyl polyoxyethylene ether, and the ratio is 1:2:1, accounting for about 2%;

[0035] The PH regulator uses amp-95 to maintain the PH value at about 6.5-7;

[0036] The complexing agent is sodium gluconate, accounting for 2%;

[0037] The extrusion agent is preferably sodium silicate, accounting for 0.2%-1.5%;

[0038] The use effect comparison of embodiment one and embodiment two is shown in the following table:

[0039]

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Abstract

The invention provides low-foam water-based diamond wire cutting liquid which comprises the following components in percentage by weight: 3-15 percent of low-foam polyether with a molecular weight of 1500-2000, 2-10 percent of polyether modified polysiloxane with a silicone oil molecular weight of 220-20000 and a polyether molecular weight of 500-2000, 0.5-7 percent of an emulsifying agent, 0.5-5 percent of a PH regulating agent, 0.5-5 percent of a complexing agent, 0.2-1.5 percent of an extrusion agent and 70-95 percent of water, wherein the emulsifying agent uses one or more of isodecanol polyoxyethylene ether, iso-tridecanol polyoxyethylene ether, isooctyl alcohol polyoxyethylene ether, glyceryl monostearate, sorbitan polyethylene laurate and sorbitan stearate; the PH regulating agent is organic amine; the complexing agent is one of or a mixture of more of sodium gluconate, potassium gluconate, sodium nitrilotriacetate, sodium citrate, potassium citrate and sodium potassium tartrate; the extrusion agent preferably selects one or several of sodium carbonate, sodium silicate and sodium sulfate. The low-foam water-based diamond wire cutting liquid provided by the invention can realize a lubricating effect, the abrasion resistance, the cooling performance and the like required to be met in the cutting process.

Description

technical field [0001] The invention relates to the solar photovoltaic field, and specifically relates to a low-foaming water-based steel wire cutting fluid. Background technique [0002] In the cutting process of photovoltaic solar silicon wafers, silicon wafer cutting fluid is an auxiliary product that must be used in the diamond wire cutting process of silicon wafers, and its consumption has also increased with the development of China's photovoltaic solar energy industry in recent years. And from the previous oil-based cutting fluid to water-based cutting fluid, the production of finished products has been greatly reduced, and it has become the current mainstream product. However, due to the rapid development of water-based cold cutting fluid, most of its research is based on the experience of metal precision processing and other industries. Polyether is the most mainstream market product. But according to the different ways of adding, it can be divided into two catego...

Claims

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Application Information

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IPC IPC(8): C10M173/02C10N30/06
CPCC10M173/02C10M2201/102C10M2207/124C10M2209/103C10M2215/042C10M2229/04C10N2030/06C10N2010/02
Inventor 孙培亚刘瑞鸿
Owner ZHENJIANG RENDE NEW ENERGY TECH
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