Metallic binding agent, diamond grinder and diamond grinder preparation method

A metal bond and diamond technology, which is applied in metal processing equipment, grinding/polishing equipment, abrasives, etc., can solve the problems of not describing the service life and grinding effect of abrasive tools, complex preparation process, etc., and achieve good self-sharpening , the effect of firm combination and easy access to materials

Active Publication Date: 2017-07-18
LENS TECH CHANGSHA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The bonding agent has many components and the preparation process is complicated. Although the self-sharpening of the abrasive tool is good, there is no description of the service life and grinding effect of the abrasive tool

Method used

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  • Metallic binding agent, diamond grinder and diamond grinder preparation method
  • Metallic binding agent, diamond grinder and diamond grinder preparation method
  • Metallic binding agent, diamond grinder and diamond grinder preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] A kind of metal bonding agent, is made up of the raw material of following weight part:

[0035] Cu80Sn20 alloy powder 81 parts; Ni powder 7 parts; Zn powder 4 parts; Fe powder 4 parts; Si powder 2 parts; glass powder 1.2 parts; graphite powder 0.8 parts.

Embodiment 2

[0037] A kind of metal bonding agent, is made up of the raw material of following weight part:

[0038] Cu80Sn20 alloy powder 82 parts; Ni powder 6 parts; Zn powder 5 parts; Fe powder 3.5 parts; Si powder 1.5 parts; glass powder 1.4 parts; graphite powder 0.6 parts.

Embodiment 3

[0040] A kind of metal bonding agent, is made up of the raw material of following weight part:

[0041] Cu80Sn20 alloy powder 79.5 parts; Ni powder 7.5 parts; Zn powder 5.5 parts; Fe powder 3 parts; Si powder 2.5 parts; glass powder 1 part; graphite powder 1 part.

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Abstract

A metallic binding agent comprises 79-83 parts of Cu80Sn20 alloy powder, 6-8 parts of Ni powder, 4-6 parts of Zn powder, 3-5 parts of Fe powder, 1-3 parts of Si powder, 1-1.5 parts of glass powder and 0.6-1 part of graphite powder. The grain size of the Cu80Sn20 alloy powder is 30-40 [mu]m, the grain size of the Ni powder, the Zn powder, the Fe powder and the Si powder is 25-35 [mu]m, the grain size of the glass powder is 10-15 [mu]m, and the grain size of the graphite powder is 5-10 [mu]m. Provided are a diamond grinder and a diamond grinder preparation method. A substrate, a transition layer connected to the substrate, and a grinding layer connected to the transition layer are included. The grinding layer is formed after the metallic binding agent and diamond grinding particles are mixed and sintered. The transition layer and the grinding layer are sintered together into a whole through the metallic binding agent. In the diamond grinder preparation method, the softening point of the metallic binding agent is 710-725 DEG C, the bending strength of the binding agent is 800-850 Mpa, the hardness is 14-14 HRC, the metallic binding agent and the diamond grinder have optimal comprehensive performance in self sharpness, grinding efficiency, grinding effect, service life and the like, and all component materials are simple and easy to obtain and low in cost.

Description

technical field [0001] The invention relates to the field of manufacturing superhard consolidated abrasives and processing hard and brittle materials, in particular to a metal bond, a diamond abrasive, and a preparation method for the diamond abrasive. Background technique [0002] At present, diamond abrasive tools are often used in the processing of hard and brittle materials such as ceramics, glass, and gemstones. Among them, resin bonded diamond abrasive tools have high grinding efficiency but low service life; vitrified bond diamond abrasive tools have high grinding efficiency and moderate service life. , but it is prone to chipping, scratches and other defects; the electroplated diamond abrasive is sharp, but its life is too short, and it needs to be replaced frequently, resulting in low production efficiency; the traditional metal bond diamond abrasive has a long service life, but the grinding The cutting efficiency is low, and defects such as blockage or burns are pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/34B24D3/06B24D18/00B22F1/00C22C26/00
CPCB22F1/0003B24D3/06B24D3/342B24D18/0009C22C26/00
Inventor 周群飞饶桥兵廖广春
Owner LENS TECH CHANGSHA
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