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Method for improving heat dissipation performance of metal middle frame and structure of metal middle frame

A technology of metal middle frame and heat dissipation performance, which is applied in the direction of telephone structure, semiconductor/solid-state device components, semiconductor devices, etc. The effect of improving heat dissipation performance and good heat uniformity

Active Publication Date: 2020-07-28
NUBIA TECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main purpose of the present invention is to propose a method for improving the heat dissipation performance of the metal middle frame and the structure of the metal middle frame, aiming at solving the problem that the existing positioning holes of the metal middle frame affect the heat conduction path of the metal middle frame, thereby affecting the heat dissipation experience of the user question

Method used

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  • Method for improving heat dissipation performance of metal middle frame and structure of metal middle frame
  • Method for improving heat dissipation performance of metal middle frame and structure of metal middle frame
  • Method for improving heat dissipation performance of metal middle frame and structure of metal middle frame

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Embodiment 1

[0070] In order to solve the above technical defects, refer to the attached figure 1 , a method for improving the heat dissipation performance of a metal middle frame provided by the present invention, the method includes the following steps:

[0071] S101. During in-mold injection molding, several positioning holes are opened on the metal middle frame, and the center of mass of the metal middle frame falls between the several positioning holes;

[0072] S102. The positioning hole is set at a position away from the heating device of the mobile terminal, avoiding opening in the projection area of ​​the heating device;

[0073] S103. Open the positioning hole on the edge of the metal middle frame, and the diameter of the positioning hole is less than 5mm.

[0074] Setting the positioning holes on the metal middle frame will significantly change the heat conduction path of the metal middle frame and affect the heat dissipation effect of the metal middle frame. Therefore, it is n...

Embodiment 2

[0076] In addition, in order to achieve the above purpose, the present invention also proposes a metal middle frame structure, which includes a middle frame body 400 and several positioning holes 430 opened in the middle frame body, and the positioning holes 430 are located in the middle frame body 400 The edge and away from the projection area of ​​the heat generating device of the mobile terminal 100; the diameter of the positioning hole 430 is less than 5mm.

[0077] Wherein, the thickness of the middle frame body 400 is 0.4mm-0.6mm, and the material of the middle frame body 400 is one of aluminum alloy 6063, aluminum-titanium alloy, aluminum-magnesium alloy and stainless steel. The metal middle frame material of the mobile terminal is a direct protection for the mobile phone in the face of extrusion or force. The higher the strength of the metal middle frame material, the less likely the mobile terminal will be deformed, which is also a protection for the use of the mobile...

Embodiment 3

[0084] Such as Figure 4 , 5 As shown, three positioning holes 430 are opened on the middle frame body 400 , and the center of mass of the middle frame body 400 falls in the triangular area formed by the three positioning holes 430 .

[0085] Such as Figure 4 As shown, the heat generating device of the mobile terminal 100 includes several heat generating chips 410 and a backlight 420, and the projection areas of the heat generating chips 410 and the back light 420 are respectively at both ends of the middle frame body 400, two of which The positioning hole 430 is opened on both sides of the projection area of ​​the backlight 420 , close to the edge of the middle frame body 400 , and the other positioning hole 430 is opened on the side of the projection area of ​​the heating chip 410 in the middle frame body 400 edge, away from the projection area of ​​the heating chip 410 .

[0086] Such as Figure 5 As shown, the heat generating device of the mobile terminal includes sev...

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Abstract

The invention discloses a method for improving heat dissipation of a metal middle frame and a metal middle frame structure. The method comprises the following steps: forming a plurality of positioning holes on the metal middle frame while performing the intra-mode injection-molding, enabling a center of mass of the metal middle frame to fall into among the plurality of positioning holes, forming positioning holes at positions far away from a heating device of a mobile terminal so as to avoid a projection region of the heating device; forming the positioning holes at the edge of the metal middle frame, wherein the aperture of each positioning hole is less than 5mm. The metal middle frame structure comprise a middle frame body and the plurality positioning holes formed at the middle frame body, each positioning hole is located at the edge of the middle frame body and far away from the projection region of the heating device of the mobile terminal; and the aperture of each positioning hole is less than 5mm. By use of the method disclosed by the invention, a technical problem that the heat dissipation experience of a user is influenced since the positioning holes on the existing metal middle frame influence a heat-conducting path of the metal middle frame is solved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of mobile terminals, in particular to a method for improving the heat dissipation performance of a metal middle frame and a structure of the metal middle frame. Background technique [0002] The middle frame of the mobile terminal is an important structure of the existing smart mobile terminal. The middle frame is the overall frame of the mobile terminal, which is used to support the internal components of the entire mobile terminal. The structure and material properties of the middle frame are important for the heat dissipation of mobile terminal products. Performance has an important impact. Generally, the heat dissipation capability of the middle frame is improved by improving the material performance. Among them, the use of a metal middle frame is a commonly used method to improve the heat dissipation performance of the middle frame in recent years. [0003] With the development of sm...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04M1/02H01L23/367
CPCH01L23/3675H04M1/026H04M1/0279
Inventor 龙静
Owner NUBIA TECHNOLOGY CO LTD
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