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Novel consolidated nano-diamond butadiene grinding disc and preparation technology thereof

A technology of nanodiamondene and grinding discs, which is applied in the field of grinding and polishing, can solve the problems of workpiece cleaning and subsequent processing, poor overall planarization effect, and difficult control of processing technology, etc., and achieves low cost, convenient cleaning and processing, and abrasive utilization. high rate effect

Inactive Publication Date: 2017-07-07
ZHENGZHOU ARTIFICIAL DIAMOND & PROD ENG TECH RES CENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1) During the grinding process, the selective processing of the surface of the processed workpiece is poor, and the global planarization effect is poor;
[0005] 2) The processing efficiency is low, and the processing technology is not easy to control;
[0006] 3) The abrasive utilization rate is low, the waste is serious, the cost is high, and the environmental pollution is large;
[0007] 4) After grinding, it is easy to cause abrasives to embed into the surface of the workpiece to be processed, which will bring troubles to workpiece cleaning and subsequent processing

Method used

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  • Novel consolidated nano-diamond butadiene grinding disc and preparation technology thereof
  • Novel consolidated nano-diamond butadiene grinding disc and preparation technology thereof
  • Novel consolidated nano-diamond butadiene grinding disc and preparation technology thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] A novel solidified nano-diamantene grinding disc is made by adding nano-diamantene to basic raw materials, and the basic raw materials are made of the following components in weight percentage: Modified E-54 epoxy resin and methyltetrahydrophthalic anhydride ( MTHPA) 55%, N,N-dimethylbenzylamine 0.5%, plasticizer (dibutyl phthalate) 3.5%, filler (modified wollastonite) 35%, pore forming agent 6%, nano The amount of diamondene added is 30wt% of the base material, and the mass ratio of E-54 epoxy resin to methyltetrahydrophthalic anhydride is 10:9.

[0052]The pore-forming agent is a mixture of graphite and salt, and the mixing ratio of the two is 1:1.

[0053] The nano-diamantene is obtained by mixing nano-diamantene with four different particle sizes of 50nm, 100nm, 200nm, and 250nm according to the mass ratio of 1:2:3:4 and then undergoing the following treatment:

[0054] ①Ultrasonic alkaline cleaning: put the mixed nanodiamondene in an alkaline cleaning tank for ult...

Embodiment 2

[0078] A novel solidified nano-diamantene grinding disc is made by adding nano-diamantene to basic raw materials, and the basic raw materials are made of the following components in weight percentage: Modified E-54 epoxy resin and methyltetrahydrophthalic anhydride ( MTHPA) 60%, N,N-dimethylbenzylamine 1%, plasticizer | (dibutyl phthalate) 4%, filler (modified wollastonite) 30%, pore former 5%, The addition amount of nanodiamondene is 33wt% of the basic raw material, and the mass ratio of E-54 epoxy resin and methyltetrahydrophthalic anhydride is 10:9.

[0079] The pore-forming agent is a mixture of graphite and salt, and the mixing ratio of the two is 1:1-2.

[0080] The nano-diamantene is obtained by mixing nano-diamantene with four different particle sizes of 50nm, 100nm, 200nm, and 250nm according to the mass ratio of 2:3:4:5 and then undergoing the following treatment:

[0081] ①Ultrasonic alkaline cleaning: put the mixed nanodiamondene in the alkaline cleaning tank for ...

Embodiment 3

[0105] A new type of consolidated nano-diamantene grinding disc is made by adding nano-diamantene to basic raw materials. The basic raw material is made of the following components in weight percentage: Modified E-54 epoxy resin and methyltetrahydrophthalic anhydride 57 %, N,N-dimethylbenzylamine 1%, plasticizer (dibutyl phthalate) 4%, filler (modified wollastonite) 33%, pore-forming agent 5%, nanodiamondene The addition amount is 20wt% of the basic raw material, and the mass ratio of E-54 epoxy resin and methyltetrahydrophthalic anhydride is 10:9.

[0106] The pore-forming agent is a mixture of graphite and salt, and the mixing ratio of the two is 1:1-2.

[0107] Described nanodiamondene is the same as embodiment 1.

[0108] The preparation method of the novel consolidated nano-diamantene grinding disc is the same as in Example 1.

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Abstract

A novel consolidated nano-diamond butadiene grinding disc is manufactured by a basic raw material and added nano-diamond butadiene, wherein the basic raw material is prepared from the following components in percentage by weight: 55-60% of modified E-54 epoxy resins and methyl tetrahydrophthalic anhydride, 0.5-1% of N,N-dimethylbenzylamine, 3.5-4% of a plasticizer, 30-35% of a filler and 5-6% of a pore-forming agent, the addition quantity of the nano-diamond butadiene is 15-33wt% of the basic raw material, and the mass ratio of E-54 epoxy resins to methyl tetrahydrophthalic anhydride is 10:9. The consolidated nano-diamond butadiene grinding disc of the invention is high in processing efficiency; in the grinding process of the consolidated nano-diamond butadiene, the utilization rate of grinding materials is high, the cost is low and the pollution to environment is low; and after the grinding of the consolidated nano-diamond butadiene grinding disc, the grinding materials cannot be embedded into the surface of a processed workpiece, and the subsequent cleaning and processing of the workpiece are conveniently carried out.

Description

technical field [0001] The invention belongs to the technical field of grinding and polishing, and in particular relates to a novel consolidated nanodiamondene grinding disc and a preparation process thereof. Background technique [0002] Since the beginning of the 21st century, the information industry represented by the IC industry has entered a stage of rapid development, and the characteristic line width of IC chips has also entered the nanometer level from the micron level. At present, the characteristic line width of IC chips is only 22 nm, and the wafer size It has also entered the era of 300mm and 400mm, and has developed to a larger size to meet the needs of increasing the output of IC chips. The surface state of the surface will directly affect the linewidth capacity of the device. At present, chemical mechanical grinding and polishing technology is used to planarize the surface of IC chips, while traditional chemical mechanical grinding and polishing uses silicon...

Claims

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Application Information

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IPC IPC(8): B24B37/14B24D18/00
CPCB24B37/14B24D18/0009
Inventor 刘永奇张召武艳强邵静茹刘创勋尹维召李盟穆小娜
Owner ZHENGZHOU ARTIFICIAL DIAMOND & PROD ENG TECH RES CENT
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