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A high-strength anti-blue LED packaging material

A technology of LED packaging and anti-blue light, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of mechanical performance degradation of packaging materials and product quality, and achieve good light transmission, reduce packaging thermal resistance, and good Effect of blue light blocking properties

Inactive Publication Date: 2020-01-14
杭州科翼科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The hardness of the packaging material has a greater effect on the use of LEDs. Lower hardness will lead to a decrease in the mechanical properties of the packaging material and reduce the product quality of the LED.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0030] Specifically, the modified sepiolite powder is prepared by the following steps: mix the sepiolite powder with a mixed solution of pentylene glycol and ethyl acetate with a mass concentration of 13%, stir, mix and disperse evenly to obtain a dispersion, wherein the pentylene glycol The mass ratio of ethyl acetate to ethyl acetate is 2:1; then add hydrochloric acid accounting for 0.5-1% of the dispersion to the dispersion, and ultrasonically treat it for 5-10 minutes, filter, wash with deionized water and dry at 60°C; then It is mixed with a compound solution, the compound solution is sodium dodecylbenzenesulfonate, aniline and isopropyl titanate, and the solvent is a mixed solution of ethanol and water, wherein the sodium dodecylbenzenesulfonate The mass concentration is 3%, the mass concentration of isopropyl titanate is 20%, and the mass concentration of aniline is 5%, mixed at 40°C for 30min, then filtered and dried at 70-80°C to obtain modified sepiolite powder . In...

Embodiment 1

[0033] A high-strength anti-blue light LED packaging material, the raw materials of which are specifically the following components: 60 parts of polysulfone modified epoxy resin, 25 parts of bisphenol F / resorcinol copolymerized epoxy resin, poly 5 parts of methyl siloxane, 0.1 part of modified or unmodified melanin, 0.1 part of hydroquinone, 8 parts of styrene-modified alkyd resin, 3 parts of modified sepiolite powder.

Embodiment 2

[0035] A high-strength anti-blue light LED packaging material, the raw materials of which are specifically the following components: 68 parts of polysulfone modified epoxy resin, 23 parts of bisphenol F / resorcinol copolymerized epoxy resin, poly 8 parts of methyl siloxane, 0.2 parts of modified or unmodified melanin, 0.3 parts of hydroquinone, 5 parts of styrene-modified alkyd resin, 10 parts of modified sepiolite powder.

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PUM

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Abstract

The invention relates to the technical field of LED electronic products, in particular to a high-strength anti-blue-ray LED packaging material. The high-strength anti-blue-ray LED packaging material comprises the components in parts by weight: 60-70 parts of polysulfone modified epoxy resin, 23-25 parts of bisphenol formaldehyde / resorcin copolymerization epoxy resin, 5-8 parts of polydimethylsiloxane, 0.1-1 parts of modified or unmodified melanin, 0.1-0.3 parts of hydroquinone, 5-8 parts of styrene modified alkyd resin and 3-10 parts of modified sea-foam stone powder. The prepared high-strength anti-blue-ray LED packaging material has the advantages that blue ray blocking performance is very high, and blue rays can be effectively filtered, so that the transmitting light is much softer and human eyes can be protected against being injured to a certain extent. Meanwhile, the high-strength anti-blue-ray LED packaging material has the advantages of high light transmission performance and smaller influence on color temperature; and moreover, the packaging thermal resistance value can be reduced as much as possible. The prepared high-strength anti-blue-ray LED packaging material provided by the invention also realizes a high mechanical property.

Description

technical field [0001] The invention relates to the technical field of LED electronic products, in particular to a high-strength anti-blue light LED packaging material. Background technique [0002] Due to its long service life, energy saving, small size and other advantages, semiconductor light-emitting diodes (LEDs) have been used in various lighting fields such as decorative lighting, automotive lighting, and backlights. LEDs have been recognized as the most valuable new technology in the 21st century. light source. However, the white light LEDs commonly used in the market generally use the blue light generated by blue light LEDs to excite phosphors to produce mixed white light. Due to this principle, many manufacturers directly increase the intensity of blue light in order to improve the brightness of LED lights, so that the produced yellow light also increases, thereby improving Brightness of white LEDs. Therefore, the actual LED spectrum contains a strong blue light ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L83/04C08L67/08C08K13/06C08K9/04C08K3/34C08K5/13C08K7/24H01L33/56
CPCC08K2201/003C08K2201/004C08K2201/011C08L63/00C08L2203/206C08L2205/025C08L2205/035H01L33/56C08L83/04C08L67/08C08K13/06C08K9/04C08K3/346C08K5/13C08K7/24
Inventor 龚毅超
Owner 杭州科翼科技有限公司
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