Method for improving sulfuration resistant and UV resistant performances of organosilicon material for LED packaging

Abstract

The invention relates to a method for improving sulfuration resistant and UV resistant performances of an organosilicon material for LED packaging. The method comprises the following steps: cleaning the surface of an LED support; preparing a coating; uniformly mixing hydrogen silicone containing resin and a solvent, wherein the weight percentage of the hydrogen silicone containing resin is 20 wt% to 25 wt%; uniformly spraying the obtained coating to a chip surface; carrying out uniform electron beam irradiation on the obtained chip surface, so that the coating is cured to form a compact silicon dioxide structure; and then removing unnecessary coating, applying the organosilicon material for LED packaging, and carrying out curing molding. The method has the beneficial effects that a packaged LED prepared and obtained by using the method disclosed by the invention overcomes the disadvantages that a traditional organosilicon material is permeable for air and moisture after being packaged and a part of the traditional organosilicon material can penetrate through a packaging material under the effect of sulfurous gas, so that the sulfuration resistance is high; after long-term ultraviolet (UV) irradiation, the stability of luminous flux can also be maintained; and the caking property of a silver layer and a silica gel interface is good, so that silver sulfide is unlikely to generate.

Description

technical field [0001] The invention relates to a method for improving the sulfuration resistance and UV resistance of organic silicon materials used for LED packaging, and belongs to the technical field of LED packaging. Background technique [0002] The packaging materials currently used in LEDs include epoxy resin, polymethyl methacrylate, glass, silicone and other highly transparent materials, among which epoxy resin and silicone materials are used as the main packaging materials, and the internal stress of epoxy resin is too large and yellowing , poor high and low temperature resistance, and poor aging resistance, while the current silicone material has small internal stress, good high and low temperature resistance, no yellowing, and higher light transmittance than epoxy resin, so it quickly replaces epoxy resin. It is widely used in the field of LED packaging, but silicone materials, especially low-refractive-index silicone materials, cause oxygen and moisture permeab...

AI Technical Summary

Problems solved by technology

[0002] The packaging materials currently used in LEDs include epoxy resin, polymethyl methacrylate, glass, silicone and other highly transparent materials, among which epoxy resin and silicone materials are used as the main packaging materials, and the internal stress of epoxy resin is too large and yellowing , poor high and low temperature resistance, and poor aging resistance, while the current silicone material has small internal stress, good high and low temperature resistance, no yellowing, and higher light transmittance than epoxy resin, so it quickly replaces epoxy resin. It is widely used in the field of LED packaging, but silicone materials, especially low-refractive-index silicone materials, cause oxygen and moisture permeability due to low cross-linking density. Under the action of sulfur-containing gases, they will partially penetrate the packaging material. Because the interface is non-adhesive, it is easy to generate silver sulfide, which leads to blackening of the silver layer. In addition, after uv irradiation, the luminous flux drops rapidly

Images