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Preparation method of printed circuit board failure region sample

A technology for printed circuit boards and samples, applied in the preparation of test samples, sampling devices, etc., can solve the problems of many wastes, low production efficiency, uneven quality, etc., and achieve the effect of improving detection efficiency

Pending Publication Date: 2017-05-31
安徽国家铜铅锌及制品质量监督检验中心
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Since there is no unified standard for printed circuit board sample preparation at present, the quality is uneven, the production accuracy is not enough, more waste products are generated in the process, and the production efficiency is low

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Slice sampling: after the failure part of the electrical performance test, the sample sampling area of ​​the printed circuit board is determined and marked with a marker pen, and the sample of the required slice size is cut out by an automatic sampler. The automatic sampler adopts a fully automatic sampling zero point and Laser spot alignment, precise cutting by milling cutter, slice size is 5×5-50×50mm;

[0025] Sealing and filling the mold: mix the epoxy resin glue, methylimidazole, and methylimidazole evenly according to the volume ratio of 9:0.9-:1, pour it into the special mold for metallographic section with sliced ​​samples, and then place it in the oven Stand for curing, the curing temperature is 50°C, and the time is 2. After the curing is completed, take out the sample to be ground and polished from the mold.

[0026] Grinding and polishing: Grinding and polishing includes rough grinding, fine grinding and polishing in sequence.

[0027] When rough grinding, ...

Embodiment 2

[0031] Slice sampling: after the failure part of the electrical performance test, the sample sampling area of ​​the printed circuit board is determined and marked with a marker pen, and the sample of the required slice size is cut out by an automatic sampler. The automatic sampler adopts a fully automatic sampling zero point and Laser spot alignment, precise cutting by milling cutter, slice size is 5×5-50×50mm;

[0032] Sealing and filling the mold: mix epoxy resin glue, alicyclic amine, and N,N-dimethylcyclohexylamine evenly according to the volume ratio of 10:1:1, and then pour it into the special mold for metallographic section with sliced ​​samples , and then placed in an oven to stand for curing, the curing temperature is 60°C, and the curing time is 3 hours. After the curing is completed, the sample to be ground and polished is taken out from the mold.

[0033] Grinding and polishing: Grinding and polishing includes rough grinding, fine grinding, and polishing in sequenc...

Embodiment 3

[0037] Slice sampling: after the failure part of the electrical performance test, the sample sampling area of ​​the printed circuit board is determined and marked with a marker pen, and the sample of the required slice size is cut out by an automatic sampler. The automatic sampler adopts a fully automatic sampling zero point and Laser spot alignment, precise cutting by milling cutter, slice size is 5×5-50×50mm;

[0038] Sealing and filling the mold: mix epoxy resin glue, polyetheramine D230, and N,N-dimethylethanolamine according to the volume ratio of 11:1.1:1, and then pour it into the special mold for metallographic section with sliced ​​samples. Then place it in an oven and let it stand for curing. The curing temperature is 70° C. and the curing time is 3.5 hours. After the curing is completed, the sample to be ground and polished is taken out from the mold.

[0039] Grinding and polishing: Grinding and polishing includes rough grinding, fine grinding, and polishing in seq...

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PUM

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Abstract

The invention discloses a preparation method of a printed circuit board failure region sample. The method comprises the following steps of slice sampling: through electric performance test, determining a sampling region of a printed circuit board sample, making a mark, and cutting the sample in the required slice dimension; uniformly mixing epoxy resin glue liquid, a curing agent and a catalyst; then, pouring the mixture into a special metallographic slice mold in which the slice sample is placed; performing still standing curing; after the curing completion, taking out the sample to be ground and polished from the mold; grinding and polishing: monitoring the distance from the surface of a region to be tested and the surface of the sample to be ground and polished, wherein the distance height is the grinding thickness; stopping grinding after the grinding is performed to the preset thickness; polishing; obtaining the printed circuit board failure region sample. The preparation method has the advantages that a slice sampler with high automation degree is used for precise sampling; the detecting efficiency and the accuracy and reliability of the detecting result are improved.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to a method for preparing samples of failure areas of printed circuit boards. Background technique [0002] Printed circuit board, also known as printed circuit board, printed circuit board, referred to as printed board, English referred to as PCB (printed circuit board) or PWB (printed wiring board), with insulating board as the base material, cut to a certain size, on which at least It is attached with a conductive pattern and has holes (such as component holes, fastening holes, metallization holes, etc.), which are used to replace the chassis of the previous electronic components and realize the interconnection between electronic components. Since such boards are made using electronic printing, they are called "printed" circuit boards. [0003] In the past ten years, my country's printed circuit board (Printed Circuit Board, referred to as PCB) manufac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N1/04G01N1/32
CPCG01N1/04G01N1/32
Inventor 晋晓峰陈庆国何纲健
Owner 安徽国家铜铅锌及制品质量监督检验中心
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