Medium-temperature silver-free copper-based brazing filler metal and method for preparing same
A copper-based solder, silver-copper technology, applied in manufacturing tools, welding equipment, metal processing equipment, etc., can solve problems such as human harm and increase costs, and achieve the effects of less equipment investment, lower production costs, and environmental protection.
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Embodiment 1
[0040] A medium-temperature silver-free copper-based solder, comprising the following components by weight percentage:
[0041] P 4.0%
[0042] Sn 1.0%
[0043] Si 0.5%
[0044] Sb 0.2%
[0045] B 0.3%
[0046] Ti 0.2%
[0047] Zr 0.2%
[0048] Ni 1.0%
[0049] The balance is Cu.
[0050] Preparation:
[0051] (1) Ingredients: Weigh raw material alloys CuP, CuB, CuTi, CuZr and elemental Sn, Si, Sb, Ni, Cu;
[0052] (2) Melting: Melt the materials prepared in step (1) in an intermediate frequency induction furnace, first add Cu, Si, Ni, and Sb to the melting crucible, and cover the materials with charcoal, turn on the intermediate frequency heating furnace, and control the temperature 900°C, add CuP, CuB, CuTi, CuZr after the charge is completely melted;
[0053] (3) Refining: After the material in step (2) is completely melted, stir the solution with a graphite rod for 5 minutes, control the intermediate frequency power so that the temperature of the melt is 900 ° C,...
Embodiment 2
[0057] A medium-temperature silver-free copper-based solder, comprising the following components by weight percentage:
[0058] P 7.5%
[0059] Sn 15.0%
[0060] Si 2.0%
[0061] Sb 1.0%
[0062] B 0.8%
[0063] Ti 1.0%
[0064] Zr 0.8%
[0065] Ni 2.0%
[0066] The balance is Cu.
[0067] Preparation method: same as Example 1.
Embodiment 3
[0069] A medium-temperature silver-free copper-based solder, comprising the following components by weight percentage:
[0070] P 5.0%
[0071] Sn 2.0%
[0072] Si 0.8%
[0073] Sb 0.2%
[0074] B 0.3%
[0075] Ti 0.2%
[0076] Zr 0.2%
[0077] Ni 0.5%
[0078] The balance is Cu.
[0079] Preparation method: same as Example 1.
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