A welding method in a wire wound potentiometer

Abstract

The invention discloses a method for performing high-pressure brazing on a resistance wire and an electrode in a wire wound potentiometer, and relates to new welding technology of microelectronic devices. The method comprises the following steps of: firstly, preparing materials to be welded, including an electrode slice of which the surface to be welded is smaller than 1mm*1mm, solid brazing filler slices in the same size, scaling powder, and the resistance wire wound on a copper core coated with an insulating layer; welding the solid brazing filler slice with the same area as the electrode slice on the surface to be welded, of the electrode slice; uniformly coating the scaling powder on the surface of the brazing filler slice on the electrode slice; finally, placing the electrode slice and the potentiometer in a positioning fixture; and welding the electrode and the resistance wire together by utilizing resistance brazing controlled by a computer program. Through the adoption of the welding method disclosed by the invention, the electrode and the resistance wire can be firmly welded, and besides, the structure of the potentiometer can be prevented from being damaged; and the method has the advantages that operation is simple, processing is convenient, properties of a joint meet usage requirements, and the production efficiency and the stability of products can be greatly improved.

Description

technical field [0001] The invention relates to the technical field of microelectronic welding, in particular to a high-temperature brazing method for a resistance wire and an electrode sheet in a wire-wound potentiometer. Background technique [0002] In the manufacture and assembly of microelectronic devices, the quality of soldering technology is the key link to determine the final quality of products. In the manufacture of microelectronic devices, since the welding area is often relatively small, the size requirements of the device are relatively high, so the requirements for welding are also higher. Leading out a wirewound potentiometer must not only provide a good, strong electrical connection, but also not subject the potentiometer to damage or stress, either internally or externally. [0003] Commonly used lead-out methods are as follows: First, a small piece of metal is brazed on several turns of wires of the resistance element, and then the metal sheet and the ext...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to design a new welding process for microelectronic devices, so as to solve the technical difficulty of welding the small area inside the microelectronic devices.

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