A packaging cover plate and packaging method of a sensitivity-enhanced electric field sensor
A technology of electric field sensor and packaging cover plate, which is applied in the direction of electric solid device, electrostatic field measurement, instrument, etc., can solve the problems of sensor sensitivity and resolution reduction, effective sensing structure area reduction, sensor sensitivity attenuation, etc., to improve the environment Adaptability, reduced relative temperature drift, and enhanced ease of use
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[0073] According to the above-mentioned packaging method and the packaging structure in which the inner core on the packaging cover plate is simultaneously convex and convex described in the specific embodiment 3, the present invention correspondingly proposes a specific embodiment 10 of the packaging method, and the steps specifically include:
[0074] Step 1: Prepare the packaging cover plate;
[0075] First, the processing of the edge 4(a) of the cover plate: process the edge 4(a) of the sheet-shaped cover plate by die stamping. Metal materials suitable for stamping include low carbon steel, stainless steel, aluminum and aluminum alloys, copper and copper alloy, etc., preferably iron-cobalt-nickel alloy. Electroplating treatment is carried out after stamping to prevent rust and oxidation. The coating is generally zinc, nickel, gold and other metals or their alloys, preferably gold coating. Holes of preset shapes such as circles and squares are reserved inside the edge 4 (a...
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