Detection method of bent sheet generated by cutting wafer

Abstract

A detection method of a bent sheet generated by a cutting wafer relates to the technical field of wafer detection. The method comprises the following steps: making a standard block with the height same to the height of the wafer and with the length greater than the length of the wafer, and processing the surface of the standard block through adopting a grinding wheel in order to properly make a long standard block convenient to use; cleaning a cut wafer to be detected; placing the standard block and the wafer on the working surface of an image measurer, and allowing the wafer to be detected to cling to the reference surface of the standard block; adjusting the lens height affecting the measurer to clearly image the seamed edge of the upper portion of the wafer; and measuring a gap between the wafer and the reference surface by using the special tool of the image measurer to accurately determine the bending. The method has the advantages of simplicity, easiness in operation, accuracy in measurement, stable quality, good product consistence, and suitableness for large-scale production.

Description

technical field [0001] The invention relates to the technical field of wafer detection, in particular to a detection method for curved pieces produced by wafer cutting. Background technique [0002] In the process of processing wafers by multi-wire slicing, bow-shaped bending sheets appear in all cases. A consensus has been reached in the industry that it is normal for multi-wire cutting to produce a certain proportion of bow-shaped bending pieces, and it is difficult to completely eliminate them. At present, the bow-shaped bending piece is generally not regarded as a technical indicator alone in the industry, and there is still a lack of research on the occurrence of the bow-shaped bending piece, and there is no good detection method. High-quality wafers are the trend of market development. Only by reducing bow-shaped and bent wafers and gradually improving product quality can we actively adapt to the needs of market development. In both piezoelectric and optical fields, ...

AI Technical Summary

Problems solved by technology

[0003] It is a blank in the industry to measure the curvature of the diced wafer. The special tools for measuring flatness on the market are not only expensive, but also the effect of measuring the curvature of the diced wafer is not ideal. Only local measurement is not intuitive and accurate enough.

[0004] At present, the rough detection method of visual inspection is traditionally used. A certain number of cut wafers are put together in a disordered order, and one end of the wafer is pinched by hand, and the gap between the wafers at the other end of the cut wafer is observed to determine the bending of the wafer. Judging qualitatively, but cannot solve quantitative and accurate judgment

Images