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A kind of treatment fluid and its application and metallization product and method

A technology for treating liquid and metallization, applied in liquid chemical plating, metal material coating process, coating, etc., can solve problems such as incomplete coating and selective metallization

Active Publication Date: 2019-04-19
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the defects that the existing methods can only carry out selective metallization on the surface of plastic substrates but cannot carry out selective metallization on other non-plastic substrates, and the plating layer formed by metallization is incomplete, and provides A new treatment liquid, the application of said treatment liquid in the selective metallization of substrate surface, a metallized product, a metallized method and the metallized product obtained by the metallized method

Method used

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  • A kind of treatment fluid and its application and metallization product and method

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preparation example Construction

[0028] The present invention does not specifically limit the preparation method of the treatment liquid, as long as the above-mentioned components in the treatment liquid can be uniformly mixed. According to a specific embodiment, the treatment solution is prepared in the following manner: adding titanate, silicate and complexing agent into a solvent, and then stirring and reacting at 50-100° C. for 1-5 hours, and then at 10 Let stand at -30°C for 1-10 hours, then add cellulose and leveling agent and stir the reaction for 1-10 minutes.

[0029] The invention also provides the application of the treatment liquid in the selective metallization of the substrate surface.

[0030] The present invention also provides a metallized product, wherein the metallized product includes a substrate, a photolithographic pattern layer and a metal layer sequentially attached on the surface of the substrate, and the photolithographic pattern layer is formed by the above-mentioned treatment liqui...

preparation example 1

[0049] This preparation example is used to illustrate the treatment liquid provided by the present invention and its preparation method.

[0050] Add 14g of butyl acetate, 25g of ethanol and 25g of isopropanol into a 150mL three-necked flask equipped with a water separator, reflux condenser, stirrer and thermometer, stir evenly, slowly add 20g of 3-hydroxybutanone under stirring, add Stir for 10 minutes after completion, then slowly add 10g tetrabutyl titanate and 5g tetraethyl silicate dropwise, raise the temperature to 60°C and stir for 3h after the dropwise addition, then let stand at 25°C for 8h, then in Add 0.8g of hydroxyethyl cellulose (number average molecular weight: 100,000) and 0.05g of leveling agent BYK333 under stirring, and stir for 5 minutes to obtain a treatment solution, which is designated as A1.

preparation example 2

[0052] This preparation example is used to illustrate the treatment liquid provided by the present invention and its preparation method.

[0053] Add 15g of butyl acetate, 15g of ethyl acetate, 20g of methanol and 25g of butanol into a 150mL three-necked flask equipped with a water separator, reflux condenser, stirrer and thermometer, stir evenly, slowly add 15g of acetylacetone under stirring, add Stir for 10 minutes after the completion, then slowly add 5g tetraisopropyl titanate and 3g tetrabutyl silicate dropwise, after the dropwise addition, raise the temperature to 70°C and stir for 2h, then stand at 20°C for 8h, then Add 0.5g of hydroxyethyl cellulose (number average molecular weight: 200,000) and 0.05g of leveling agent BYK333 under stirring, and stir for 5 minutes to obtain a treatment solution, which is designated as A2.

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Abstract

The invention relates to the field of substrate surface metallization, and provides a treating fluid and an application thereof as well as a metallized product and a method. The treating fluid contains titanate, silicate ester, cellulose and a complexing agent, wherein the complexing agent is a compound which contains at least one group of acetylacetonate, carboxylate radicals, carbonyl, alkoxy, azide groups, nitrato, amido and halogen. When the treating fluid provided by the invention is used for metallizing the substrate surface, the limit of the prior art to substrate materials can be eliminated, an integral metal coating can be formed, and the treating fluid has great industrial application prospects.

Description

technical field [0001] The present invention relates to the field of metallization of substrate surfaces, in particular, to a treatment solution, application of the treatment solution in selective metallization of substrate surfaces, a metallized product, a metallization method, and a metallization method by the treatment solution. The metallized product obtained by the method. Background technique [0002] A metal layer is formed on the surface of the substrate, which is widely used in the fields of automobile, industry, computer, communication and other fields as the path of electromagnetic signal conduction. Among them, selectively forming a metal layer on the surface of the substrate is a core link in the manufacture of such products. [0003] At present, the method of selective metallization on the surface of the substrate is usually to mix active substances into the surface of the substrate that needs to be metallized, and then engrave the pattern that needs to be met...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/42
Inventor 冷世伟林宏业
Owner BYD CO LTD
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