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Ring part structure and machining method thereof

A processing method and ring technology, which is applied in the ring structure and its processing field, can solve the problems of spalling and tip discharge particles, and achieve the possible effects of reducing the tip, improving the service life, and reducing the phenomenon of peeling of attached particles

Inactive Publication Date: 2017-03-22
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the surface of the ring pattern is prone to the problem of tip discharge (Arcing) or peeling of adsorbed particles (Peeling)

Method used

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  • Ring part structure and machining method thereof
  • Ring part structure and machining method thereof
  • Ring part structure and machining method thereof

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Experimental program
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Embodiment Construction

[0035] It can be seen from the background art that the rings in the prior art have the problem that the surface of the pattern is prone to tip discharge or peeling off of the adsorbed particles. Now combine the structure of the ring to analyze the causes of the tip discharge and the peeling off of the adsorbed particles:

[0036] As mentioned in the background technology, the ring has two main functions in the sputtering process: one is to restrict the trajectory of the sputtered ions and play a role of focusing; the other is to absorb the particles produced in the sputtering process to purify role.

[0037] refer to figure 2 ,show figure 1 Schematic diagram of the pattern on the surface of the middle ring.

[0038] In order to improve the adsorption capacity of the ring to particles, the surface of the ring is provided with patterns to increase the roughness of the surface of the ring and improve the adsorption capacity of the surface of the ring. However, if the pattern...

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PUM

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Abstract

The invention provides a ring part structure and a machining method thereof. The machining method comprises the following steps: providing a ring part of which the surface is provided with patterns; and roughening the patterned surface of the ring part. According to the machining method provided by the invention, the patterned surface of the ring part is further roughened to increase the roughness degree of the patterned surface of the ring part, to reduce tips on the patterned surface of the ring part and to increase the adsorption capacity of the patterned surface of the ring part, and thus the possibility of occurrences of tip discharge of the patterned surface of the ring part and peeling of adsorbed particles is reduced, so the service life of the ring part is prolonged, product rejection caused by peeling of the adsorbed particles is reduced, and the product yield is increased.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a ring structure and a processing method thereof. Background technique [0002] The semiconductor sputtering process is one of the most critical process steps in the production process of semiconductor chips. Its purpose is to deposit metal or metal compounds in the form of thin films on silicon wafers or other substrates, and then cooperate with photolithography and etching processes. , eventually forming a complex wiring structure in the semiconductor chip. The sputtering process is mainly completed by the sputtering machine, and the ring structure is one of the consumables in the sputtering machine. [0003] Specifically, refer to figure 1 , shows a schematic structural diagram of a sputtering device in the prior art. [0004] The sputtering target 10 is arranged above the surface 11 to be deposited, and the ring 12 is arranged between the sputtering target 10 and...

Claims

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Application Information

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IPC IPC(8): C23C14/34
Inventor 姚力军潘杰相原俊夫大岩一彦王学泽陈雪
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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