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Thixotropic insulating PCB (printed circuit board) organosilicone electronic-pouring sealant

A PCB circuit board, insulation type technology, applied in the direction of adhesives, polymer adhesive additives, non-polymer adhesive additives, etc., can solve the problems of low performance, can not meet the use requirements of potting glue, etc., to achieve good Effects of fluidity and transparency, small molecular weight, good dispersion and compatibility

Inactive Publication Date: 2017-03-15
铜陵市超远精密电子科技有限公司
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  • Summary
  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

However, the potting compound synthesized in this article can not meet the requirements of the potting compound on the market for PCB circuit boards, and its performance is not high in all aspects, so it must be further improved to expand the scope of use.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] A silicone electronic potting adhesive for thixotropic insulated PCB circuit boards, prepared from the following raw materials in parts by weight (kg): vinyl-terminated silicone oil 40, vinyl-terminated silicone oil 50, 12% platinum catalyst 0.38, acetylene Cyclohexanol 0.02, vinyl silicone resin 25, 1-allyloxy-2,3-propylene oxide 14.8, 1,3,5,7-tetramethylcyclotetrasiloxane 23, silane coupling agent A1712.7, appropriate amount of hydrogen-containing silicone oil, hydrogenated castor oil 1, nanoporous quartz powder 4.5, acrylic resin 3.3, silane coupling agent KH560 0.2, absolute ethanol amount.

[0015] The silicone electronic potting glue for a thixotropic insulating type PCB circuit board is prepared by the following specific steps:

[0016] (1) Add 1-allyloxy-2,3-propylene oxide, 1,3,5,7-tetramethylcyclotetrasiloxane and silane coupling agent A171 in sequence in a four-necked flask, and stir Add 1 / 4 of the 12% platinum catalyst dropwise under the conditions, react a...

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Abstract

The invention discloses a thixotropic insulating PCB organosilicone electronic-pouring sealant. The thixotropic insulating PCB organosilicone electronic-pouring sealant is high in curing hardness, compressive strength and shock resistance, achieves insulation protection of various electronic components and meanwhile obtains rapid thixotropic performance after being mixed, thereby being particularly applicable to pouring-sealed components with tiny gaps and worth popularizing.

Description

technical field [0001] The invention relates to the technical field of potting glue for printed circuit boards, in particular to a silicone electronic potting glue for a thixotropic insulating type PCB circuit board. Background technique [0002] With the rapid development of electronic science and technology, electronic components, devices, instruments and meters have been widely used in the electronic industry. Since the working environment of many electronic devices is complex and changeable, and sometimes even encounters extremely harsh natural conditions, in order to protect electronic components and integrated circuits from the working environment and improve the electrical performance and stability of electronic devices, it is necessary to The device is potted for protection. Potting is one of the important processes in the assembly of electronic devices. It is to fill the gaps of electronic devices with potting materials by mechanical or manual methods, and process ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/04C09J11/06C09J11/08
CPCC09J183/04C08K2201/011C08L2201/02C08L2201/10C08L2203/206C08L2205/025C08L2205/035C09J11/04C09J11/06C09J11/08
Inventor 汪海燕
Owner 铜陵市超远精密电子科技有限公司
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