Heat dissipation device and manufacturing method thereof

A technology of a heat dissipation device and a manufacturing method, which is applied in the manufacturing of semiconductor/solid state devices, electrical components, electric solid state devices, etc., can solve the problems of waste materials, poor flatness, groove tolerance, etc.

Active Publication Date: 2017-03-08
ASIA VITAL COMPONENTS SHENZHEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] 1. Overweight
[0008] 2. Consuming materials
[0009] 3. The groove has tolerance problems
[0010] 4. Poor levelness (or poor flatness) of the back of the base

Method used

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  • Heat dissipation device and manufacturing method thereof
  • Heat dissipation device and manufacturing method thereof
  • Heat dissipation device and manufacturing method thereof

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Embodiment Construction

[0078] The above-mentioned purpose of the present invention and its structural and functional characteristics will be described according to the embodiments of the accompanying drawings.

[0079] The invention provides a heat dissipation device and a manufacturing method thereof. see figure 1 , Figure 2A , Figure 2B , is the exploded and combined three-dimensional and combined cross-sectional schematic diagram of the first embodiment of the present invention. The heat dissipation device 1 includes a base plate 11 and at least one heat pipe 13, the base plate 11 is made of metal material (such as copper material), and the base plate 11 has at least one accommodating hole 111, the accommodating hole 111 is formed by the base plate 11 The top side 113 runs through the bottom side 114 opposite to the substrate 11, and the shape of the accommodating hole 111 in this preferred example is described as a zigzag shape (such as an S shape), but it is not limited thereto. , the sha...

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PUM

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Abstract

The invention relates to a heat dissipation device and a manufacturing method thereof. The heat dissipation device comprises a substrate and at least one heat pipe which is arranged in a containing hole of the substrate. Two sides of the heat pipe are pressed and deformed to be close to the two opposite inner walls in the containing hole, thus the substrate and the heat pipe are closely combined to be a whole body, the problem that a known hole needs secondary processing and the back side flatness is poor due to processing are solved, and the effects of cost saving and uniform temperature can be achieved at the same time.

Description

[0001] 【Technical field】 [0002] The present invention relates to a heat dissipation device and a manufacturing method, in particular to a heat dissipation device capable of saving materials, controlling the depth of accommodating holes, maintaining the flatness of the top and bottom sides of the substrate, and effectively achieving temperature uniformity. Device and manufacturing method. [0003] 【Background technique】 [0004] In recent years, with the rapid development of information, communication and optoelectronic industries, electronic products are gradually becoming high-end and thinner. Under the demand of high speed, high frequency and miniaturization, the heat density of electronic components is getting higher and higher, so the heat dissipation Efficiency has become an important factor in determining the stability of electronic products; due to the high-efficiency heat transfer characteristics of heat pipes or heat conduction sheets, they are already one of the wid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/427H01L23/367H01L21/48
Inventor 林胜煌林源忆
Owner ASIA VITAL COMPONENTS SHENZHEN CO LTD
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