A kind of boron-doped diamond electrode with high specific surface area and its preparation method and application
A diamond electrode, high specific surface area technology, applied in electrodes, chemical instruments and methods, electrolysis process, etc., can solve the problem of electrodes restricting the mass transfer efficiency of the electrode surface, to improve sewage treatment efficiency, improve mass transfer process, wide window Effect
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Embodiment 1
[0072] Embodiment 1: flat type (board)
[0073] (1) cleaning the flat niobium substrate;
[0074] (2) adopting the magnetron sputtering method to deposit a layer of metal chromium layer with a thickness of 500nm on the flat niobium surface;
[0075] (3) Place the chromium-modified flat niobium in the suspension of nanocrystalline and microcrystalline diamond mixed particles, vibrate in ultrasonic for 30 minutes, and disperse evenly to obtain a niobium matrix with nanocrystalline and microcrystalline diamond particles adsorbed on the surface .
[0076] (4) Boron-doped diamond film is deposited by hot wire CVD, deposition process parameters: hot wire distance 6mm, deposition temperature 700-750°C, hot wire temperature 2200°C, deposition pressure 3KPa, gas ratio (CH 4 :H 2 :B 2 h 6 ) (sccm) is 3:97:0.3, obtains diamond film thickness 20 μ m by controlling deposition time;
[0077] (5) The boron-doped diamond surface prepared in step (4) adopts the magnetron sputtering depos...
Embodiment 2
[0081] Embodiment 2: flat type (board)
[0082] (1) cleaning the tungsten sheet;
[0083] (2) Place the tungsten sheet in a suspension of mixed particles of nanocrystalline and microcrystalline diamond, oscillate in an ultrasonic wave for 30 minutes, and disperse evenly to obtain a niobium matrix with nanocrystalline and microcrystalline diamond particles adsorbed on the surface.
[0084] (3) Boron-doped diamond film was deposited by hot wire CVD, deposition process parameters: hot wire distance 6mm, deposition temperature 700-750°C, hot wire temperature 2200°C, deposition pressure 3KPa, gas ratio (CH 4 :H 2 :B 2 h 6 ) (sccm) is 3:97:0.3, obtains diamond film thickness 25 μ m by controlling deposition time;
[0085] (4) The boron-doped diamond surface prepared in step (3) adopts the magnetron sputtering deposition method to deposit a metal nickel layer, and the specific sputtering parameters are sputtering current 400mA, argon flow 10sccm, sputtering pressure 0.4Pa, sputte...
Embodiment 3
[0089] Embodiment 3: flat type (board)
[0090] (1) silicon wafer is cleaned;
[0091] (2) Place the silicon chip in a suspension of mixed particles of nanocrystalline and microcrystalline diamond, vibrate in an ultrasonic wave for 30 minutes, and disperse evenly to obtain a niobium substrate with nanocrystalline and microcrystalline diamond particles adsorbed on the surface.
[0092] (3) Boron-doped diamond film was deposited by hot wire CVD, deposition process parameters: hot wire distance 6mm, deposition temperature 700-750°C, hot wire temperature 2200°C, deposition pressure 3KPa, gas ratio (CH 4 :H 2 :B 2 h 6 )(sccm) is 3:97:0.3, deposition time 4h;
[0093] (4) The boron-doped diamond surface prepared in step (3) adopts the magnetron sputtering deposition method to deposit a metal nickel layer, and the specific sputtering parameters are sputtering current 400mA, argon flow 10sccm, sputtering pressure 0.4Pa, sputtering Time 60s;
[0094] (5) Put the sample obtained i...
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