Ceramic drilling method of composite nanosecond-picosecond-femtosecond laser technology

Abstract

The invention discloses a ceramic drilling method of a composite nanosecond-picosecond-femtosecond laser technology. The ceramic drilling mechanism of the composite nanosecond-picosecond-femtosecond laser technology comprises the following steps: S10, providing multi-pulse-width fiber laser devices which comprise a nanosecond laser device, a picosecond laser device and a femtosecond laser device, roughly machining a ceramic workpiece fixed on a working table by using the nanosecond laser device, and meanwhile, spraying auxiliary gas at a position nearby a machining position; S20, carrying out finish machining on the ceramic workpiece which is machined roughly by using the picosecond laser device or the femtosecond laser device, and meanwhile, spraying auxiliary gas at a position nearby the machining position; and S30, presetting allowance for finish machining T, detecting residual allowance for machining t by using a dimension precision measurement instrument, repeating the step S10 when t is greater than T, repeating the step S20 when t is greater than 0 and smaller than or equal to T, and repeating in such a way until t is equal to 0. The auxiliary gas is sprayed at the position nearby the machining position, after rough machining by nanosecond laser, finish machining is implemented by picosecond or femtosecond laser, and therefore, machining precision and machining efficiency of the ceramic workpiece are improved.

Description

technical field [0001] The invention relates to ceramic processing, in particular to a ceramic drilling method using composite nanosecond-picosecond-femtosecond laser technology. Background technique [0002] Ceramics are typical hard, brittle and difficult-to-machine materials, and their micropore processing is a major problem in today's processing industry. The ceramic hole processing methods mainly include the following three types: (1) The traditional mechanical drilling method not only limits the ceramic aperture, but also tends to produce cracks on the processing surface and hole wall of the ceramic material, which makes the workpiece scrap; (2) EDM method, because the ceramic material is usually non-conductive, so it is necessary to modify the ceramic, and the EDM speed is slow, the electrode life is short, the efficiency of processing micropores is low, and the cost is high; (3) laser processing method, because the laser has high energy It is dense and easy to guide...

AI Technical Summary

Problems solved by technology

The ceramic hole processing methods mainly include the following three types: (1) The traditional mechanical drilling method not only limits the ceramic aperture, but also tends to produce cracks on the processing surface and hole wall of the ceramic material, which makes the workpiece scrap; (2) EDM method, because the ceramic material is usually non-conductive, so it is necessary to modify the ceramic, and the EDM speed is slow, the electrode life is short, the efficiency of processing micropores is low, and the cost is high; (3) laser processing method, because the laser has high energy Density and easy to guide and focus, through heat scattering, the material can be melted and evaporated in an instant, realizing non-contact processing with the workpiece, avoiding problems such as tool wear and tear, and has demonstrated advantages in the field of ceramic drilling

At present, there are three main pulse widths of lasers used for ceramic hole processing: nanoseconds, picoseconds, and femtoseconds; among them, nanosecond lasers are commonly used in industry, and their processing efficiency is high, but the heat-affected zone of processing materials Obviously, recasting layers and thermal cracks are prone to occur on the surface and wall of the hole, which seriously affects the processing accuracy and quality; while the processing efficiency of picosecond and femtosecond lasers is not as good as that of nanosecond lasers, but their cold processing characteristics are suitable for processing workpieces. Finishing with control and even elimination of recast layers, hot cracks

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