Target-sputtering self-circulating cooling device

Abstract

The invention belongs to the field of magnetron sputtering, and particularly relates to a target-sputtering self-circulating cooling device for the target cooling technology. The device comprises a target and a cooling structure. The target is cooled through a synthetic jet method. The target is connected to the upper end of a metallic cathode in a butt joint manner and sealed at the upper end of the metallic cathode. A synthetic jet generator is fixed in a synthetic jet cavity to generate intermittent jetted gas. The jetted gas is stored through the synthetic jet cavity and is sprayed out along a spray nozzle. The sprayed jetted gas impacts on fins on the inner side of the target to achieve the cooling effect, the gas obtained after temperature rise enters a cooling passageway, and the cooled gas returns to the synthetic jet cavity again to be recycled.

Description

technical field [0001] The invention belongs to the field of magnetron sputtering, aims at the heat dissipation technology of a target, and in particular relates to a sputtering target self-circulation cooling device. Background technique [0002] As a new surface treatment technology, physical vapor deposition technology has high technological content, zero pollution, and can greatly improve the performance and service life of tools, and has been widely valued by people. As the most successful physical vapor deposition technology today, arc ion plating technology is widely used in the surface treatment of cutting tools, molds and auto parts, and has been continuously improved and improved. Arc ion plating technology can be divided into circular arc, rectangular arc and columnar arc according to the shape of the cathode arc. Among them, the most widely used is the arc target technology because of its small size, light weight, easy operation, and The size of the vacuum equip...

AI Technical Summary

Problems solved by technology

[0003] In the arc ion plating technology, the target temperature is high, which is not conducive to the stable output of plasma. The existing cathode target cooling devices mostly use water cooling to cool down. The method is to circulate water on the back of the target to keep the target at a lower temperature.

In the production process, with the consumption of the target material, the target material needs to be replaced frequently to prevent the cooling from entering the vacuum cavity. Therefore, it is very inconvenient to replace the target material in this way, and the vacuum cavity is extremely easy to enter water, and it is slightly cooled accidentally. Water enters the vacuum chamber, which seriously affects the vacuum and greatly reduces the quality of the coating. At the same time, it also brings great trouble to the replacement of the target. In addition, the number of small arc targets on the vacuum chamber ranges from a few to dozens. This further increases the cumbersomeness of the work and affects the improvement of production efficiency.

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