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Polymide resin, method for manufacturing the same and thin film thereof

A technology of polyimide resin and manufacturing method, which is applied in the direction of printed circuits, electrical components, printed circuits, etc., and can solve the problems of LCP film processing and product application limitations, difficulty in controlling dimensional stability, poor mechanical properties, etc.

Active Publication Date: 2017-01-18
MICROCOSM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the unique molecular structure of LCP is prone to excessive alignment, resulting in poor mechanical properties in the transverse direction, which severely limits the processing and application of LCP films.
In addition, the unique molecular structure characteristics of LCP also cause its polymer glass transition temperature (Tg) to be close to the melting point (Tm), which makes it difficult to control the dimensional stability of the flexible copper foil substrate applied in the thermocompression process.

Method used

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  • Polymide resin, method for manufacturing the same and thin film thereof
  • Polymide resin, method for manufacturing the same and thin film thereof
  • Polymide resin, method for manufacturing the same and thin film thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0101]24.20g (0.076mol) of 2,2'-bis(trifluoromethyl)benzidine (TFMB), 1.85g (0.017mol) of p-phenylenediamine (PDA), 2.36g (0.008mol) of 1 , 3-bis(4-aminophenoxy)benzene (TPE-R) and 244.37g of N-methyl-2-pyrrolidone (NMP) were put into a three-necked flask. After stirring at 30°C until completely dissolved, add 41.75g ​​(0.091mol) of p-phenylene bis(trimellitate dianhydride) (TAHQ) and 2.83g (0.005mol) of 4,4'- (4,4'-isopropyldiphenoxy)bis(phthalic anhydride) (PBADA), followed by continuous stirring and reaction at 25° C. for 24 hours to obtain the polyamic acid solution of Example 1. In this embodiment, the weight of the dianhydride monomer and the diamine monomer accounts for about 23wt% of the total weight of the reaction solution [(24.20+1.85+2.36+41.75+2.83) / (24.20+1.85+2.36+41.75+2.83+244.37) ×100%=23%].

Embodiment 2

[0103] 26.28g (0.082mol) of 2,2'-bis(trifluoromethyl)benzidine (TFMB), 3.74g (0.009mol) of 2,2'-bis[4-(4-aminophenoxy ) phenyl] propane (BAPP) and 215.78g of N-methyl-2-pyrrolidone (NMP) were put into a three-necked flask, stirred at 30°C until completely dissolved, then added 39.88g (0.087mol) of p- -Phenyl bis(trimellitate dianhydride) (TAHQ) and 2.02 g (0.005 mol) of 4,4'-(hexafluoropropylene) bis-phthalic anhydride (6FDA), followed by Stir and react at 25° C. for 24 hours to obtain the polyamic acid solution of Example 2. In this embodiment, the weight of the dianhydride monomer and the diamine monomer accounts for about 25 wt% of the total weight of the reaction solution [(26.28+3.74+39.88+2.02) / (26.28+3.74+39.88+2.02+215.78)×100%= 25%].

Embodiment 3

[0105] 29.13g (0.091mol) of 2,2'-bis(trifluoromethyl)benzidine (TFMB), 1.84g (0.017mol) of p-phenylenediamine (PDA), 1.66g (0.006mol) of 1 , Put 3-bis(4-aminophenoxy)benzene (TPE-R) and 271.31g of N-methyl-2-pyrrolidone (NMP) into a three-necked flask, stir at 30°C until completely dissolved , and then added 47.12g (0.102mol) of p-phenylene bis(trimellitate dianhydride) (TAHQ) and 5.92g (0.011mol) of 4,4'-(4,4'-isopropyl Diphenoxy) bis(phthalic anhydride) (PBADA), followed by continuous stirring and reaction at 25° C. for 24 hours to obtain the polyamic acid solution of Example 3. In this embodiment, the weight of the dianhydride monomer and the diamine monomer accounts for about 24wt% of the total weight of the reaction solution [(29.13+1.84+1.66+47.12+5.92) / (29.13+1.84+1.66+47.12+5.92+271.31) ×100%=24%].

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Abstract

The invention discloses a polymide resin, a method for manufacturing the same and thin film thereof. The polyimide resin is derived from at least two dianhydrides and at least two diamines. The dianhyride is selected from a group consisting of p-phenylenebis (trimellitate anhydride), 4,4'-(hexafluoroisopropylidene)-diphthalic anhydride, and 4,4'-(4,4' -isopropylidenediphenoxy)bis(phthalic anhydride). One of the diamine monomers is 2,2' -bis(trifluoromethyl)benzidine, and the molar ratio of the 2,2'-bis(trifluoromethyl)benzidine to the diamine monomers is between 70% and 90%; and the other diamine monomers are selected from a group consisting of 4,4'-diaminobenzanilide, 4,4'-methylenedianiline, 2,2-bis[4-(4-aminophenoxy)phenyl, 4,4'-diaminodiphenyl-sulfone, 1,3-bis(4-aminophenoxy)benzene, 4,4'-oxydianiline, p-phenylenediamine, 4,4'-diamino-2,2'-dimethyl-1,1'-biphenyl and 2,2-bis[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane.

Description

technical field [0001] The invention relates to a polyimide resin and its manufacturing method and film, in particular to a polyimide resin with low dielectric loss factor and linear thermal expansion coefficient, which can be used in the insulating layer of high-frequency substrates. Background technique [0002] Flexible printed circuit board (Flexible Printed Circuit Board, FPCB) has been widely used in mobile communication and portable electronic products with high density, small size and high performance due to its flexible characteristics. With the high frequency of wireless transmission and high speed of data transmission, high frequency substrates will gradually become the focus of future development. One of the requirements for high-frequency substrates is that the integrity of data signals must be preserved under high-frequency and high-speed transmission, and the transmission process must not cause signal loss or interference. [0003] Polyimide (Polyimide) Flexi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08L79/08
CPCC08G73/1067C08G73/1071C08J5/18C08J2379/08C08L79/08C08L2201/08C08L2203/16C08G73/1042C08G73/1046H05K1/0326H05K1/0393H05K2201/0154H05K2201/068
Inventor 黄堂杰郑思齐
Owner MICROCOSM TECH
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