Method for improving groove-making burrs before copper plating

A gong groove and sinking copper technology, which is applied in mechanical/acoustic circuit processing, electrical components, printed circuit manufacturing, etc., to reduce scrapping problems, meet customer needs, and reduce scrapping rates

Active Publication Date: 2017-01-11
广东喜珍电路科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of this, the present invention provides a method for improving the topping of gong grooves before sinking copper, which realizes low-cost input and high-quality output, effectively solves the problem of f

Method used

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  • Method for improving groove-making burrs before copper plating
  • Method for improving groove-making burrs before copper plating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] This embodiment provides a method for improving the front edge of the gong groove before sinking copper, including the following steps:

[0023] S1. Select the material number of the gong groove in front of sinking copper to retrieve the corresponding drill and gong data;

[0024] S2. Select the zero position to drill the positioning hole to ensure that there are no repeated holes and half holes;

[0025] S3. Install a positioning pin 0.05mm smaller than the hole diameter on the drilled hole;

[0026] S4. Adopt split-knife production, the first gong knife gong slot compensation goes to the upper limit, and the second gong knife repair and batch front compensation goes to the lower limit;

[0027] S5. Drill offset test holes, and drill holes at 200mm in the X and Y directions of the direction holes to confirm the offset status;

[0028] S6. After the first piece is finished, use the hole point film to confirm the position of the gong groove and the condition of the gon...

Embodiment 2

[0038] The method for improving the front edge of the gong groove in the present embodiment is consistent with that of Embodiment 1. The difference is that in the present embodiment, the composition of the cladding layer is C 16 parts, Si 7 parts, Mg 3 parts, Cr 2 parts, Ni 9 parts, Al 10 parts, Ti 8 parts, Cu 12 parts.

[0039] Through the cladding layer, the heat generated by the gong knife during processing can be effectively conducted to avoid overheating of the processing part and damage to parts. At the same time, the cladding layer has high rigidity, which can effectively resist the impact during processing and prevent the wear of the tool.

Embodiment 3

[0041] The method for improving the front edge of the gong groove in the present embodiment is consistent with that of embodiment 1, the difference is that in the present embodiment, the composition of the cladding layer is calculated in parts by weight: 16 parts of C, 7 parts of Si, 9 parts of Mg, 5 parts of Cr, 9 parts of Ni, 15 parts of Al, 8 parts of Ti, and 12 parts of Cu.

[0042] Through the cladding layer, the heat generated by the gong knife during processing can be effectively conducted to avoid overheating of the processing part and damage to parts. At the same time, the cladding layer has high rigidity, which can effectively resist the impact during processing and prevent the wear of the tool.

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Abstract

The invention provides a method for improving groove-making burrs before copper plating. Low-cost input and high-quality output are realized, the problem of the groove-making burrs before copper plating is effectively solved, the scrap rate of the groove-making burrs is greatly reduced, the appearance and the quality of the product are improved, and the product quality is improved to meet the demand of customers.

Description

technical field [0001] The present invention designs the technical field of PCB board manufacture, and in particular relates to a method for improving the front edge of gong grooves before sinking copper. Background technique [0002] With the continuous development of PCB technology, the process technology and equipment capabilities of circuit boards have been in a relatively stable state for a certain period of time. However, the market competition is becoming increasingly fierce, and delivery and quality are also the focus of competing customers. The circuit board needs to be grooved before the PNL board is made of copper, and the front is often produced during this process, which greatly affects the quality of the product. At the same time, the front also has a great impact on the subsequent processing, making the product defective The high product rate not only increases the production cost of the enterprise, but also seriously affects the reputation of the enterprise...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0044H05K2203/02
Inventor 付雷黄勇贺波
Owner 广东喜珍电路科技有限公司
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