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Light emitting diode, electronic device and manufacture method

A technology for light-emitting diodes and a manufacturing method, which is applied to electric solid-state devices, electrical components, semiconductor devices, etc., can solve the problems of large volume of light-emitting diodes, and achieve the advantages of reducing the overall volume, reducing the packaging volume, and avoiding the increase of the volume of light-emitting diodes. Effect

Active Publication Date: 2017-01-04
SHENZHEN SUNSCREEN CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide a light-emitting diode. By setting blind holes and filling the blind holes, it aims to solve the technical problem of large volume of light-emitting diodes in the prior art when the light-emitting diode chip is packaged.

Method used

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  • Light emitting diode, electronic device and manufacture method
  • Light emitting diode, electronic device and manufacture method
  • Light emitting diode, electronic device and manufacture method

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Embodiment Construction

[0036] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0037] Please refer to Figure 1 to Figure 5 , the thin light emitting diode provided by the embodiment of the present invention includes:

[0038] The circuit substrate 10 includes a first surface 12 and a second surface 14 oppositely disposed, a first metal circuit layer 22 formed on the first surface 12 , and a second metal circuit layer 24 formed on the second surface 14 And a plurality of metal connection parts 25 penetrating through the first surface 12 and the second surface 14 to connect the first metal circuit layer 22 and the second metal circuit layer 24 and provided with blind holes 26...

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Abstract

The invention is applicable to the semiconductor packaging technology field and provides a light emitting diode, an electronic device having the light emitting diode, a manufacture method for the light emitting diode and a manufacture method for the electronic device. The light emitting diode provides blind holes and the blind holes is filled, such that a problem in the prior art that the volume of the light emitting diode after packaging is big. The light emitting diode comprises a circuit substrate, a light emitting diode wafer and a sealing adhesive body. The circuit substrate comprises a first metal circuit layer, a second metal circuit layer and a metal connection portion provided with the blind holes; the blind hole is filled with conductive materials; and the light emitting diode wafer is arranged on the first meta circuit layer. The blind holes are formed on the first circuit substrate and is filled with conductive materials in order to make circuits on the first surface and the second surface of the circuit substrate electrically connect, which greatly reduces the volume of the sealing adhesive body and reduces the volume of the light emitting diode.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging, and in particular relates to a light emitting diode, an electronic device with the light emitting diode, a manufacturing method of the light emitting diode and a manufacturing method of the electronic device. Background technique [0002] The traditional printed circuit board type light emitting diode packaging technology is to solidify the light emitting diode chip on a printed circuit board, and connect it to the circuit on the printed circuit board through a metal wire, and the P-type electrode of the light emitting diode chip is connected to the The N-type electrodes are respectively connected to the two copper foil conductive films on the printed circuit board, and the light-transmitting adhesive material is covered by injection molding to protect the light-emitting diode chip, and the printed circuit board is between two adjacent light-emitting diode chips. The electrode des...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/48H01L33/62H01L33/54
CPCH01L2224/48091H01L2224/48227H01L2224/48471H01L2924/181H01L2924/00014H01L2924/00012
Inventor 宋文洲
Owner SHENZHEN SUNSCREEN CO LTD
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