Microchannel liquid cooling heat radiator and conduction cool plug for high heat flux chip

Abstract

The invention relates to a microchannel liquid cooling heat radiator and a conduction cool plug for a high heat flux chip. The microchannel liquid cooling heat radiator is fixedly arranged on one side of the chip, and comprises a chip package plate, a cover plate and a cooling liquid circulation device. The chip package plate is packaged and fixed on one side of the chip. The edge of the other side of the chip package plate and the edge of the cover plate are sealed and fixedly connected. A circulation cavity is formed between the chip package plate and the cover plate. A number of heat radiating teeth are arranged on one side of the chip package plate in the circulation cavity. The cover plate is provided with a liquid inlet hole and a liquid outlet hole. The liquid inlet hole and the liquid outlet hole are respectively communicated with a cooling liquid circulation device through liquid cooling pipes. According to the heat radiator provided by the invention, a microchannel heat radiating structure with a number of heat radiating teeth is arranged on one side of the chip package plate in the circulation cavity; the contact heat resistance is reduced; the heat exchange efficiency is improved; and the heat radiator is favorable for heat radiating of the high heat flux density heating chip and other concentrated heat sources.

Description

Technical field [0001] The invention relates to a liquid cooling radiator, in particular to a microchannel liquid cooling radiator and a conductive cooling plug-in for a chip with a high heat flux density. Background technique [0002] With the increasing integration of plug-ins, the heat dissipation problem of power chips with high / ultra-high heat flux density on plug-in printed boards has become the focus of structural design and thermal design research. [0003] Traditional heat conduction methods include air cooling and liquid cooling. Most of the heat dissipation is after the chip is packaged, the heat of the heating chip is taken away by the cold plate, and the surface of the cold plate and the heating chip is reduced by thermal pads or thermal grease Contact thermal resistance, at the same time, the cold plate can be a conduction cooling type or a liquid cooling type with a coolant flow channel inside. This method has a relatively simple structure design and high reliability...

AI Technical Summary

Problems solved by technology

[0004] However, the current application of ultra-large-scale gate array chips and transmitting and receiving chips has caused the heating power of the chip itself to rise sharply, and the local heat flux can even reach more than 500W / cm. Therefore, integrated circuit design and structural / thermal design need to be carried out at the same time , to carry out collaborative design to meet the heat dissipation requirements of existing chips

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