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Soldering technology of electronic module

A welding process and electronic module technology, applied in welding equipment, printed circuits, manufacturing tools, etc., can solve problems affecting product reliability, etc., and achieve the effect of easy judgment and low acid value

Inactive Publication Date: 2016-12-21
ANHUI BEILAI ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

And a bad solder joint will affect the reliability of the entire product

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A welding process for electronic modules, characterized in that the steps comprise:

[0029] (1) cleaning

[0030] Place the substrate in the cleaning solution and clean it by ultrasonic cleaning. After cleaning, put the substrate in an oven to dry at 55°C for 30 minutes;

[0031] (2) Replica

[0032] Re-engrave the component layout pattern on the surface of the substrate, and determine the position of the component layout;

[0033] (3) Component aging

[0034] Carry out the aging test on the components and the substrate, and only after passing the inspection can they be welded;

[0035] (4) Microscopic examination

[0036] Check the substrate with a high-power digital microscope, wipe the substrate with 70% alcohol, and operate in one direction when wiping;

[0037] (5) Soldering

[0038] Apply resin flux to the soldering position of the substrate with a thickness of 3mm;

[0039] (6) PCB welding

[0040] In this process, the PCB is soldered on the substrate, a...

Embodiment 2

[0046] A welding process for electronic modules, characterized in that the steps comprise:

[0047] (1) cleaning

[0048] Place the substrate in the cleaning solution and use ultrasonic cleaning to clean it. After cleaning, put the substrate in an oven to dry at a temperature of 55°C for 40 minutes;

[0049] (2) Replica

[0050] Re-engrave the component layout pattern on the surface of the substrate, and determine the position of the component layout;

[0051] (3) Component aging

[0052] Carry out the aging test on the components and the substrate, and only after passing the inspection can they be welded;

[0053] (4) Microscopic examination

[0054] Check the substrate with a high-power digital microscope, wipe the substrate with 78% alcohol, and operate in one direction when wiping;

[0055] (5) Soldering

[0056] Apply resin flux to the soldering position of the substrate with a thickness of 4mm;

[0057] (6) PCB welding

[0058] In this process, the PCB is soldere...

Embodiment 3

[0064] A welding process for electronic modules, characterized in that the steps comprise:

[0065] (1) cleaning

[0066] Place the substrate in the cleaning solution and use ultrasonic cleaning to clean it. After cleaning, put the substrate in an oven to dry at a temperature of 55°C for 50 minutes;

[0067] (2) Replica

[0068] Re-engrave the component layout pattern on the surface of the substrate, and determine the position of the component layout;

[0069] (3) Component aging

[0070] Carry out the aging test on the components and the substrate, and only after passing the inspection can they be welded;

[0071] (4) Microscopic examination

[0072] Check the substrate with a high-power digital microscope, wipe the substrate with 85% alcohol, and operate in one direction when wiping;

[0073] (5) Soldering

[0074] Apply resin flux to the soldering position of the substrate with a thickness of 5mm;

[0075] (6) PCB welding

[0076]In this process, the PCB is soldered...

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Abstract

The invention discloses a soldering technology of an electronic module. According to the soldering technology of the electronic module, a substrate is cleaned in an ultrasonic cleaning manner in the step (1), so that fine particles on the surface of the substrate can be thoroughly cleaned up through the ultrasonic cleaning manner; a resin type soldering flux is adopted in the step (5), and the resin type soldering flux is low in acid value, free of toxicity and harm and capable of being widely applied to soldering technologies and has the soldering assisting function; two kinds of solder are applied to a PCB and a lithium battery in the step (6) and the step (7) for different characteristics of the elements, and therefore the soldering quality is guaranteed; and in the step (8), the electricity detecting manner is that a coulometer is used for detecting the current of each soldered element when the soldered element is connected with a 220-V power source and judging whether a soldered portion is in short circuit or not, by the adoption of the manner, all the parts of each element can be detected, the pertinence is achieved, and the soldering condition of each element can be more easily judged.

Description

technical field [0001] The invention relates to the field of electronic equipment, in particular to a welding process for electronic modules. Background technique [0002] An important process in the assembly process of electronic products when soldering. The quality of welding directly affects the performance of electronic circuits and electronic devices. Excellent welding quality can provide good stability and reliability for the circuit. Bad welding methods will cause damage to components, bring great difficulties to testing, and sometimes leave hidden dangers, affecting the reliability of electronic devices. As the complexity of electronic products increases, the number of components used is increasing. Some electronic products use hundreds or even thousands of components, and the number of solder joints is tens of thousands. And a bad solder joint will affect the reliability of the entire product. Soldering quality is the key to the quality of electronic products. ...

Claims

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Application Information

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IPC IPC(8): B23K1/00B23K1/20B23K101/42
CPCB23K1/00B23K1/20B23K1/206B23K2101/42
Inventor 周淑清
Owner ANHUI BEILAI ELECTRONICS TECH CO LTD
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