Pressing ring apparatus and reaction chamber
A reaction chamber and pressure ring technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of melting of the support 14, deflection of the pressure ring 13, and affecting the normal lifting of the pressure ring 13, so as to avoid Damage the chip, ensure normal operation, and ensure the effect of normal lifting
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[0030] In order to enable those skilled in the art to better understand the technical solution of the present invention, the ring pressure device and the reaction chamber provided by the present invention will be described in detail below with reference to the accompanying drawings.
[0031] Figure 2A A cross-sectional view of the pressure ring device provided by the embodiment of the present invention during the process. Figure 2B for Figure 2A Zoom-in view of the middle I region. image 3 A cross-sectional view of the pressing ring device provided by the embodiment of the present invention when performing the operation of picking and placing the sheet. Please also refer to Figure 2A , Figure 2B and image 3 , a chuck 22 is provided in the reaction chamber 20, and the chuck 22 is a device for carrying the wafer 21, and may be an electrostatic chuck, a mechanical chuck, or the like. The pressure ring device is used to cover the edge of the wafer 21 placed on the chu...
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