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Mask assembly, manufacturing method of integrated circuit board and integrated circuit board

A technology for integrated circuit boards and masks, which is applied in the fields of circuits, semiconductor/solid-state device manufacturing, and electrical components, and can solve problems such as increased design costs, high manufacturing costs, unfavorable process production methods, and optimized process conditions.

Active Publication Date: 2018-12-28
FOUNDER MICROELECTRONICS INT
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  • Abstract
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Problems solved by technology

[0002] In the related art, in the process of manufacturing integrated circuit boards, a set of mask components is usually used to complete the manufacturing process of an integrated circuit board. In the process of designing integrated circuit boards, if users want to verify the feasibility In order to improve performance and reliability, it is necessary to prepare multiple sets of masks, and the production cost of mask components is extremely high (thousands to tens of thousands), which leads to an increase in design costs, which is not conducive to improving process production methods and optimizing process conditions

Method used

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  • Mask assembly, manufacturing method of integrated circuit board and integrated circuit board
  • Mask assembly, manufacturing method of integrated circuit board and integrated circuit board
  • Mask assembly, manufacturing method of integrated circuit board and integrated circuit board

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Embodiment Construction

[0041] In order to understand the above-mentioned purpose, features and advantages of the present invention more clearly, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0042] In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described here. Therefore, the protection scope of the present invention is not limited by the specific details disclosed below. EXAMPLE LIMITATIONS.

[0043] Figure 1A , 1B , 2A, 2B, 3A, and 3B show schematic diagrams of various embodiments of a mask assembly according to an embodiment of the present invention. The mask assembly according to an emb...

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Abstract

The invention provides a mask board component, a preparation method of an integrated circuit board and the integrated circuit board. The mask board component comprises a first mask board and a second mask board. The first mask board is provided with a first transmitting pattern and a first opaque pattern. The first mask board is used for the first time of photoetching technology processing in the preparation process of the integrated circuit board. The first transmitting pattern comprises a pattern under preparation of a patterned mask layer arranged on a first resistivity structure layer. The second mask board is provided with a second transmitting pattern and a second opaque pattern. The second mask board is used for the second time of photoetching technology processing in the preparation process of the integrated circuit board. The second transmitting pattern comprises a pattern under preparation of a second resistivity gate electrode. With application of the technical scheme, the integrated circuit board can be prepared by using at least two processing methods so that the processing cost of the photoetching technology can be reduced, and technology optimization in the process of mass production of the integrated circuit board is facilitated.

Description

technical field [0001] The invention relates to the technical field of integrated circuit manufacturing, in particular to a mask assembly, a method for preparing an integrated circuit board and an integrated circuit board. Background technique [0002] In the related art, in the process of manufacturing integrated circuit boards, a set of mask components is usually used to complete the manufacturing process of an integrated circuit board. In the process of designing integrated circuit boards, if users want to verify the feasibility In order to improve performance and reliability, it is necessary to prepare multiple sets of masks, and the production cost of mask components is extremely high (thousands to tens of thousands), which leads to an increase in design costs, which is not conducive to improving process production methods and optimizing process conditions . [0003] Therefore, how to design a mask assembly compatible with various manufacturing methods and a correspond...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/98H01L21/033
Inventor 康冬亮陈建国
Owner FOUNDER MICROELECTRONICS INT
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