Photoetching vacuum clamp for perforated ceramic chip of thin-film circuit

Abstract

The invention discloses a photoetching vacuum clamp for a perforated ceramic chip of a thin-film circuit, and aims at providing a vacuum adsorption clamp which has the advantages that clamping is convenient, the universality is high, and the yield is high. According to the photoetching vacuum clamp, marked line endpoint vacuum absorption holes (17) which take an air guide hole (4) as the center and bypass the free ends of aligning marked lines (6) are perforated in an adsorption platform (2), and then an inner ring seal groove (12) of a rectangular ring groove is formed; the orthogonal air guide hole and crisscross air guide slots (14) which are overlapped and radiated with diagonal lines of the rectangular ring groove are perforated in the region of the inner ring seal groove, vacuum adsorption holes (16) are perforated in the four endpoints of the crisscross lines, a middle layer air guide groove (15) which is a ring groove formed by the moment structure at the roots of the aligning marked lines and an outer layer inner ring seal groove (13) which surrounds the middle layer air guide groove are perforated in the periphery of the inner ring seal groove (12), vacuum adsorption holes are distributed on the four corners of the bearing face of a ceramic chip workpiece and communicated with the crisscross air guide slots, and during the working process, the vacuum adsorption holes adsorb the four corners of the ceramic chip to fix the ceramic chip workpiece.

Description

technical field [0001] The invention relates to a thin-film circuit photolithography vacuum jig with holes, which is suitable for MJB4 automatic lithography vacuum equipment with different functions and two-way vacuum adsorption carrying platforms. Background technique [0002] In the manufacturing process of ceramic thin film circuit substrates, the design graphics are transferred to the coated ceramics, so as to achieve the synchronization of the design graphics and the product circuit graphics, and a process called photolithography is used to achieve the above purpose. The current method for photoetching thin film circuit patterns on ceramic substrates is to use UV-sensitive positive photoresist as a resist, and perform photolithographic imaging of thin film circuit patterns on the upper surface of ceramic substrates. After a series of follow-up processes, a ceramic thin film circuit is finally formed. The photolithography process includes three processes of gluing, phot...

AI Technical Summary

Problems solved by technology

Because of the hole in the middle of the ceramic chip with holes, the vacuum hole on the surface of the adsorption fixture will leak air, so that the ceramic chip cannot be vacuum adsorbed and fixed by the vacuum equipment stage, and the vacuum adsorption will fail, and the alignment between the substrate and the photolithography plate cannot be completed Work

If adhesive tape is used to fix the ceramic workpiece, the first defect is that the thickness of the tape produces a gap that makes the edge of the exposed figure vignetting, which affects the dimensional stability of the high-frequency circuit; the second defect is that the tape is sandwiched between the ceramic chip and the photolithography plate as a protrusion, The high precision of graphics requires that the lithography machine adopts the hard contact mode. The lifting platform of the vacuum equipment will automatically raise the hard top photolithography plate of the ceramic workpiece. Since the thickness of the photolithography plate is much larger than that of the ceramic workpiece, it is the ceramic workpiece that is damaged.

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