Pinhole-free type high-heat-conduction graphite adhesive tape

Abstract

The invention discloses a pinhole-free type high-heat-conduction graphite adhesive tape. The pinhole-free type high-heat-conduction graphite adhesive tape is made through the following steps of coating a layer of a graphite modifying agent on the upper surface and the lower surface of a polyimide thin film so as to obtain a treated polyimide thin film, wherein the graphite modifying agent is made from the following components in parts by weight: pyromellitic dianhydride, BTDA, diaminodiphenylmethane, dimethyl formamide, N-methylpyrrolidinone, glycol and polydimethylsiloxane; raising the temperature of the treated polyimide thin film to 800 DEG C, performing heat preservation, raising the temperature to 1200 DEG C, performing heat preservation, and performing cooling so as to obtain a prefiring carbonization film; calendering the prefiring carbonization film through a calender; raising the temperature to 2900 DEG C, performing heat preservation, and then performing cooling so as to obtain a main firing graphite membrane; and calendering the main firing graphite film so as to obtain a graphite layer. According to the pinhole-free type high-heat-conduction graphite adhesive tape disclosed by the invention, the heat-conducting properties in a perpendicular direction and in a horizontal direction are improved, the heat-conducting uniformity is realized, and local superheating of the adhesive tape is avoided.

Description

technical field [0001] The invention relates to a high thermal conductivity graphite adhesive tape, which belongs to the technical field of heat dissipation film. Background technique [0002] With the rapid development of modern microelectronics technology, electronic devices (such as laptops, mobile phones, tablet computers, etc.) are increasingly becoming ultra-thin and lightweight. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easy to discharge , Easy to accumulate rapidly and form high temperature. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducting, lightweight material to qui...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, polyimide films are mostly used for flexible circuit boards. Although polyimide films are sintered to obtain graphite heat sinks, which can be pasted on heat sources, they are limited by the quality and quality of polyimide films. The performance is uneven, which affects the heat dissipation performance of the heat dissipation double-sided film. There are the following technical problems: uneven heat dissipation, prone to local overheating of the tape, improved product heat dissipation performance instability, poor reliability performance, and is not conducive to product quality control. affect product competitiveness