Plasma equipment for vapor phase etching and cleaning

Abstract

The present invention relates to a plasma device for gas phase etching and cleaning, comprising: a reactor body for processing a target substrate; a region for directly generating plasma, which is a region for directly generating plasma in the reactor body, and a process a gas flows into the reactor main body to directly induce plasma; a plasma induction component induces plasma to the direct plasma generation area; a substrate processing area is provided in the reactor main body and is The plasma flowing into the direct plasma generating region and the vaporized gas flowing in from the outside of the reactor main body form reactive species, and process the target substrate through the reactive species; and double gas distribution baffles, It is disposed between the directly generating plasma region and the substrate processing region, distributes plasma to the substrate processing region, and distributes boil-off gas to a central region and a peripheral region of the substrate processing region.

Description

technical field [0001] The present invention relates to a plasma device for gas-phase etching and cleaning, and in more detail, relates to a device for selectively cleaning by directly using highly reactive atoms or molecules to directly react with a thin film on the surface of a target substrate Plasma units for vapor phase etching and cleaning. Background technique [0002] Semiconductors are active electronic components with functions such as storage, amplification, and switching of electronic signals, and have high integration, high performance, and low power consumption. They are high value-added and leading digital informatization in the traction system industry and service industry Core components of the era. [0003] The semiconductor manufacturing process can be roughly divided into the front process (wafer processing process) and the back process (assembly process and inspection process), and the front process equipment accounts for about 75% of the market share. ...

AI Technical Summary

Problems solved by technology

For example, it is difficult to carry out the processing process in a vacuum atmosphere in a process chamber equipped with a vacuum chuck

Moreover, the above process is operated in one way, so when a problem occurs with the suction cup, it is necessary to stop the process operation or replace the suction cup, thereby reducing productivity and increasing maintenance costs

Images