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Resin composition

A technology of resin composition and compound, applied in the direction of epoxy resin glue, adhesive type, adhesive additive, etc., can solve the problem of insufficient PCT resistance, etc., and achieve the effect of excellent PCT resistance

Active Publication Date: 2016-10-26
NAMICS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, it will obviously make PCT resistance insufficient

Method used

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Embodiment

[0082] Hereinafter, the present invention will be described in detail using examples. However, the present invention is not limited to these Examples.

[0083] (Preparation of resin composition)

[0084] Resin compositions were prepared by mixing the respective components according to the compounding ratios shown in Tables 1 to 12 below. In addition, in Tables 1-12, the figure which shows the compounding ratio of (A) component - (F) component all shows a mass part.

[0085] Each component in Tables 1-10 is as follows.

[0086] (A) Ingredients

[0087] EXA835LV: Bisphenol F type epoxy resin - bisphenol A type epoxy resin mixture (manufactured by DIC Corporation, epoxy equivalent 165)

[0088] YDF8170: bisphenol F epoxy resin (manufactured by Nippon Steel Chemical Co., Ltd., epoxy equivalent 160)

[0089] ZX1658GS: Cyclohexanedimethanol diglycidyl ether (manufactured by Nippon Steel Chemical Co., Ltd., epoxy equivalent 135)

[0090] (B) Ingredients

[0091] TS-G: a compou...

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Abstract

Provided is a resin composition that is suitable as a one-component adhesive to be used during production of image sensor modules and electronic components due to being heat-curable at a temperature of approximately 80 DEG C and having exceptional PCT resistance. This resin composition is characterized by containing (A) an epoxy resin, (B) a compound shown by formula (1), (C) a curing accelerator, and (D) a silane coupling agent, the contained amount of the compound of component (B) being from 1:0.5 to 1:2.5 by equivalent ratio of epoxy groups in the epoxy resin of component (A) and thiol groups in the compound of component (B), the contained amount of the silane coupling agent of component (D) being from 0.2 to 50 parts by mass per 100 total parts by mass of component (A), component (B), component (C), and component (D), and the equivalent ratio of thiol groups in the compound of component (B) and Si in the silane coupling agent (D) being from 1:0.002 to 1:1.

Description

technical field [0001] The present invention relates to a resin composition suitable for a one-component adhesive for applications requiring thermosetting at a relatively low temperature, specifically, thermosetting at about 80°C. The resin composition of the present invention is suitable for use when manufacturing image sensor modules used as camera modules of mobile phones or smartphones, or electronic components such as semiconductor elements, integrated circuits, large-scale integrated circuits, transistors, thyristors, diodes, and capacitors. One-component adhesive. In addition, the resin composition of the present invention is also expected to have a use as a liquid sealing material used in the manufacture of semiconductor devices. Background technique [0002] When manufacturing an image sensor module used as a camera module of a mobile phone or a smartphone, a one-component adhesive that is thermally cured at a relatively low temperature, specifically at a temperatu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/66C08K5/54C08L63/00C09J11/06C09J163/00
CPCC08G59/56C08G59/66C08K3/22C08K3/36C08K5/005C08K5/3462C08K5/37C08K5/5435C08K5/55C08K2003/2227C08L63/00C09J163/00C08J3/24C08K5/0025C08K5/54C09J11/06C08K5/06C09J2203/326
Inventor 岩谷一希新井史纪
Owner NAMICS CORPORATION
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