Production technology of copper and aluminum composite transition connection terminal
A kind of terminal, copper-aluminum composite technology, applied in connection, conductive connection, contact manufacturing and other directions, can solve the problems of complex production process, low mechanization strength, low production yield and other problems, achieve simple production process, strong penetration performance, The effect of improving corrosion resistance
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Embodiment 1
[0015] The production process of the copper-aluminum composite transition terminal of the present invention comprises the following steps:
[0016] The first step: put the solid copper into the melting furnace to melt into liquid copper, then enter the constant temperature furnace for degassing and slag treatment, and then the liquid copper enters the crystallization in the composite casting device under the vacuum state through the draft tube In the device, and solidified into a copper tube in the crystallizer;
[0017] Step 2: Put the solid aluminum into the melting furnace to melt into liquid aluminum, and then the liquid aluminum enters the constant temperature furnace for degassing and slag treatment, then the liquid aluminum enters the copper in the crystallizer through the draft tube and then through the pouring tube In the tube, and condensed with the copper tube to form a copper-aluminum composite material, one end of the copper-aluminum composite material is tubular,...
Embodiment 2
[0024] Wherein the passivation liquid mass percent of the 4th step in the production technique of above-mentioned embodiment 1 is composed of sodium polydithiodipropane sulfonate 0.4%, polydimethylamide group sodium sulfonate 0.3%, hydroxy ethylidene diphosphonic acid 0.1%, nano silicon oxide 2.1%, dioctyloxypyrophosphate group 15%, and the balance is water.
Embodiment 3
[0026] Wherein the passivation liquid mass percent of the 4th step in the production technique of above-mentioned embodiment 1 is composed of sodium polydithiodipropane sulfonate 0.6%, polydimethylamide group sodium sulfonate 0.35%, hydroxy ethylidene diphosphonic acid 6%, nano silicon oxide 2.5%, dioctyloxypyrophosphate group 18%, and the balance is water.
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