A method and equipment for preparing polytetrafluoroethylene circuit boards
A polytetrafluoroethylene and circuit board technology, applied in the field of electronics, can solve the problems of inability to meet high-density assembly requirements, insufficient film bonding force, weak peel resistance, etc., and achieve improved peel strength and high peel resistance. , the effect of enhanced peel strength
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[0039] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0040] It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.
[0041] Below in conjunction with accompanying drawing, each preferred embodiment of the present invention is described further:
[0042] method embodiment
[0043] In this embodiment, a metal film layer is prepared on the base layer, the selected base layer is polytetrafluoroethylene, refer to...
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