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One-component room temperature vulcanized conductive silica gel and preparation method thereof

A technology of conductive silica gel and room temperature vulcanization, which is applied in the direction of conductive adhesives, adhesives, non-polymer adhesive additives, etc., to achieve the effects of good adhesion, simple operation, and slow viscosity change

Active Publication Date: 2020-04-17
刘行
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In order to solve the technical problems of the above-mentioned existing conductive silica gel, the present invention provides a high-strength single-component room temperature vulcanized conductive silica gel and a preparation method thereof

Method used

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  • One-component room temperature vulcanized conductive silica gel and preparation method thereof
  • One-component room temperature vulcanized conductive silica gel and preparation method thereof
  • One-component room temperature vulcanized conductive silica gel and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0029]

[0030] The preparation method of one-component RTV conductive silica gel of the present invention, the steps are as follows:

[0031] Step 1: Preparation of conductive filler and treatment agent

[0032] Put the conductive filler on a metal or ceramic plate, and bake it in an oven at 50°C for 1 hour to remove the moisture absorbed in the conductive filler; put the conductive filler and treatment agent into a planetary mixer according to the ratio of conductive silica gel, and disperse Stir for 30 minutes at a stirring speed of 100 rpm to prepare the conductive filler and treatment agent.

[0033] Step 2: Preparation of conductive silicone material

[0034] Weigh various raw materials according to the ratio of the conductive silica gel, first put the hydroxyl silicone oil, MQ resin, conductive filler and treatment agent, and filler into a planetary mixer, stir for 1 hour, disperse at a speed of 500 rpm, and vacuum degree -0.1 MPa, material temperature 30°C. After...

Embodiment 2

[0036]

[0037]

[0038] Preparation steps:

[0039] (1) Preparation of conductive filler and treatment agent

[0040] Put the conductive filler on a metal or ceramic plate, and bake it in an oven at 50°C for 2 hours to remove the moisture absorbed in the conductive filler; put the conductive filler and treatment agent into a planetary mixer according to the ratio of conductive silica gel, and disperse Stir for 20 minutes at a stirring speed of 70 rpm to prepare the conductive filler and treatment agent.

[0041] (2) Preparation of conductive silicone material

[0042] Weigh various raw materials according to the ratio of the conductive silica gel, first put the two kinds of hydroxyl silicone oils with different viscosities, MQ resin, conductive filler and treatment agent, and filler into the planetary mixer, stir for 1.5h, and disperse at a speed of 1250rpm, vacuum degree -0.1MPa, material temperature 15°C. After stirring evenly, add the cross-linking agent, and then...

Embodiment 3

[0044]

[0045]

[0046] Preparation method:

[0047] (1) Preparation of conductive filler and treatment agent

[0048] Put the conductive filler on a metal or ceramic plate, and bake it in an oven at 50°C for 3 hours to remove the moisture absorbed in the conductive filler; put the conductive filler and treatment agent into a planetary mixer according to the ratio of conductive silica gel, and disperse Stir for 10 minutes at a stirring speed of 40 rpm to prepare the conductive filler and treatment agent.

[0049] (2) Preparation of conductive silicone material

[0050]Weigh various raw materials according to the ratio of the conductive silica gel, first put the two kinds of hydroxyl silicone oils with different viscosities, MQ resin, conductive filler and treatment agent, and filler into the planetary mixer, stir for 2 hours, and disperse at a speed of 2000rpm , vacuum degree -0.1MPa, material temperature 10°C, after stirring evenly, add the crosslinking agent, and th...

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Abstract

The invention provides single-component room-temperature vulcanization conductive silica gel. The conductive silica gel is characterized by being prepared from the following raw materials in a weight ratio: base silicon rubber to a cross-linking agent to conductive fillers and a treatment agent to fillers of 100 to (10-20) to (300-450) to (2-3), wherein the weight ratio of the conductive fillers to the treatment agent is 100 to (1-2). The base silicon rubber is composed of hydroxyl silicone oil and MQ resin; the conductive fillers are composed of silver-plated copper powder, silver powder, nickel-plated graphite and the like; and the cross-linking agent is composed of diethyl amino methyl triethoxy silane or chloromethylethoxy silane. The invention further discloses a preparation method of the single-component room-temperature vulcanization conductive silica gel. The conductive silica gel has good conductive and shielding performances, the hardiness is moderate and is 40-50 degrees, the anti-ageing performance is good and ranges from -70 DEG C to 200 DEG C, the mechanical strength is good and the utilization is convenient; the single-component room-temperature vulcanization conductive silica gel is tightly adhered to a contact surface when used for an electronic connection device, has high bonding strength and elasticity and has conductive and shielding performances and sealing and vibration-absorption effects. The single-component room-temperature vulcanization conductive silica gel is applicable to conductive and shielding binding in the fields including cell phone communication and the like.

Description

technical field [0001] The invention belongs to a conductive shielding material, in particular to a high-strength single-component room temperature vulcanized conductive silica gel and a preparation method thereof. Background technique [0002] With the development of science and technology, electromagnetic wave interference is increasingly affecting the usability and safety of communication equipment such as mobile phones. In order to solve this problem, conductive materials are usually used to shield electromagnetic waves. For example, metal or conductive plastic shells are used, but the shell The shielding effect of the seams, bonding points or small holes will be reduced, so these parts need to use conductive rubber materials with certain elasticity, and conductive silicone rubber with good mechanical properties and weather resistance is an ideal choice. [0003] Silicone rubber material has a small shrinkage rate after curing and will not produce adhesive layer stress, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/06C09J183/04C09J9/02C09J11/06C09J11/04
CPCC08K2201/014C08L2205/02C08L2205/025C08L2205/03C09J9/02C09J11/04C09J11/06C09J183/06C08L83/04C08K13/02C08K3/04C08K5/544C08K3/36C08K2003/0806C08L83/06
Inventor 李培贺超刘行袁海宾程相宾贺珍
Owner 刘行
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