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Printing method and device for inkjet and liquid metal mixed printing and product

A liquid metal and inkjet technology, applied in the directions of copying/marking methods, printing, typewriters, etc., can solve the problem of adding silk screen or marking to liquid metal printed circuits, and achieve flexible screen marking forms, convenient operation, and improved circuit integration. Effect

Inactive Publication Date: 2016-08-17
BEIJING DREAM INK TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Liquid metal printed circuit has a wide application prospect. At present, there are relatively mature and stable liquid metal printed circuit printing equipment. In the production of liquid metal circuit, the printing of silk screen layer will also be an indispensable part. The current printing The device cannot add silk screen or marking for liquid metal printed circuit yet, so a method is needed to realize the silk screen layer addition based on liquid metal printed circuit

Method used

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  • Printing method and device for inkjet and liquid metal mixed printing and product
  • Printing method and device for inkjet and liquid metal mixed printing and product
  • Printing method and device for inkjet and liquid metal mixed printing and product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Such as figure 1 As shown, in the printing method and device for inkjet and liquid metal mixed printing provided in the first embodiment, the liquid metal printing nozzle 1 and the ink printing nozzle 2 are respectively connected to the printing controller 4, and the printing controller 4 can be controlled separately Liquid metal printing nozzle 1 and ink printing nozzle 2 so that liquid metal printing nozzle 1 and ink printing nozzle 2 can print liquid metal wires 7 and silk screen marks 8 on substrate 3 in a preset order or at the same time, so that they can print at one time A printed circuit printed with liquid metal wires 7 and silk screen marks 8 is printed. The printing method is carried out by using the device, and has the characteristics of high integration, convenient operation and flexible form of the silk screen mark 8. The generated product can effectively expand the complexity and applicability of the existing liquid metal printed circuit.

[0047] The device...

Embodiment 2

[0060] Such as Figure 5 , Image 6 As shown, the device structure of the second embodiment is basically the same as that of the first embodiment, and the similarities will not be repeated. The difference is: in the device of the second embodiment, the packaging device is connected to the print controller 4 for packaging The material is encapsulated outside the liquid metal wire layer 9 or the silk screen marking layer 10, that is, the packaging device is used to encapsulate the packaging material on the substrate 3 printed with the liquid metal wire 7 or the silk screen mark 8.

[0061] The printing method and products of the second embodiment are basically the same as those of the first embodiment, and the similarities will not be repeated. The difference is: in the printing method of the second embodiment, the liquid metal is controlled by the printing controller 4 in step S2. The printing nozzle 1 and the ink printing nozzle 2 respectively print liquid metal wires 7 and silk s...

Embodiment 3

[0070] Such as Figure 8 As shown, the third embodiment adopts the printing method of the first embodiment or the second embodiment, and the generated product is the same as the first embodiment or the second embodiment. The basic structure of the device of the third embodiment is basically the same as that of the first or second embodiment, except that the liquid metal printing nozzle 1 and the ink printing nozzle 2 of the third embodiment are installed on the same spray gun. When printing the liquid metal wire 7, the liquid metal printing nozzle 1 can be opened through the printing controller 4, and the ink printing nozzle 2 can be closed; when the silk screen mark 8 is printed, the ink printing nozzle 2 can be opened through the printing controller 4 and the liquid Metal printing nozzle 1; when it is necessary to print liquid metal and silk screen marks 8 at the same time, the liquid metal printing nozzle 1 and ink printing nozzle 2 can be opened at the same time.

[0071] It...

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PUM

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Abstract

The invention relates to the technical field of printed circuit manufacturing equipment, in particular to a printing method, device and product for mixed printing of inkjet and liquid metal. In the printing method and device for inkjet and liquid metal mixed printing of the present invention, the liquid metal printing nozzle and the ink printing nozzle are respectively connected to the printing controller, and the printing controller can control the liquid metal printing nozzle and the ink printing nozzle respectively, so as to The liquid metal printing nozzle and the ink printing nozzle print the liquid metal wire and the silk screen mark respectively on the substrate in a preset order or at the same time, so that the printed circuit printed with the liquid metal wire and the silk screen mark can be printed at one time. The printing method is carried out by using the device, which has the characteristics of high integration, convenient operation and flexible silk screen marking form, and the generated product can effectively expand the complexity and applicability of the existing liquid metal printed circuit.

Description

Technical field [0001] The present invention relates to the technical field of printed circuit manufacturing equipment, in particular to a printing method, device and product for mixed printing of inkjet and liquid metal. Background technique [0002] Integrated circuit printing technology is a technology widely used in the fields of consumer electronics, industrial production, electrical equipment, and medical monitoring. Its main feature is to realize the miniaturization and research and development of electronic equipment through process standardization, flow and integration Rapid iteration of production. Integrated circuit printing technology promotes the development of the information age and is also the cornerstone of contemporary industrial civilization. [0003] A printed circuit is generally composed of a substrate, wires, packaging materials, and a silk screen layer. The substrate provides the mechanical strength required by the circuit board and provides an attachment m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/12H05K3/14B41J3/407B41J3/44B41J2/01B41M5/00B22F3/115B33Y10/00B33Y30/00
CPCH05K3/125B22F3/115B33Y10/00B33Y30/00B41J2/01B41J3/407B41J3/445B41M5/0047H05K3/14H05K2203/0121H05K2203/013
Inventor 姚又友刘静于洋
Owner BEIJING DREAM INK TECH CO LTD
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