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Colorless and transparent low dielectric constant polyimide film and preparation method thereof

A technology of polyimide film and polyamic acid, which is applied in the field of colorless transparent low dielectric constant polyimide film and its preparation, polyimide material, can solve problems such as difficult to achieve, and achieve simple technical process , easy industrial production, and the effect of reducing the dielectric constant

Active Publication Date: 2016-08-17
WUXI SHUNXUAN NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At the same time, due to the excellent high and low temperature resistance and chemical stability of polyimide, it is also often used as a flexible substrate material for film solar cells or as a flexible substrate for a new generation of OLED lighting / display instead of glass. The light transmittance of the amine film puts forward higher requirements, but the existing materials are difficult to meet this requirement

Method used

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  • Colorless and transparent low dielectric constant polyimide film and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0019] Add 2,2'-bis[4-(4-aminophenoxybenzene)]hexafluoropropane and 4,4'-(hexafluoroisopropene)diphthalic anhydride at a molar ratio of 1:1 to N,N' -In dimethylacetamide (DMAc), control the solution mass concentration to 15%, control the solution temperature to 40°C, and fully stir for 4 hours to fully react the monomers to obtain a polyamic acid solution with a viscosity of 28000Pa.s, and the viscosity within 2 hours The value does not vary by more than 2%.

[0020] Referring to the polyimide salivation process mentioned in the specific embodiment of the Chinese patent (application number CN 200610039940.7), the composite solution obtained in step 3 was made into a polyimide film with a thickness of 12.5 μm.

Embodiment 2

[0022] Add 2,2'-bis[4-(4-aminophenoxybenzene)]hexafluoropropane and 4,4'-(hexafluoroisopropene)diphthalic anhydride at a molar ratio of 1:1 to N,N' - In dimethylformamide (DMF), control the solution mass concentration to 20%, the solution temperature to 30°C, and fully stir for 5 hours to fully react the monomers to obtain a polyamic acid solution with a viscosity of 32000Pa.s, and the viscosity value within 2 hours Changes do not exceed 2%.

[0023] Referring to the polyimide salivation process mentioned in the specific embodiment of the Chinese patent (application number CN 200610039940.7), the composite solution obtained in step 3 was made into a polyimide film with a thickness of 15 μm.

Embodiment 3

[0025] Add 2,2'-bis[4-(4-aminophenoxybenzene)]hexafluoropropane and 4,4'-(hexafluoroisopropene) diphthalic anhydride at a molar ratio of 1:1 to N'-formaldehyde In NMP, the mass concentration of the solution was controlled at 25%, the solution temperature was 50°C, and fully stirred for 4 hours to fully react the monomers to obtain a polyamic acid solution with a viscosity of 36000 Pa.s, and the change in viscosity value within 2 hours did not exceed 2 %.

[0026] Referring to the polyimide salivation process mentioned in the specific embodiment of the Chinese patent (application number CN 200610039940.7), the composite solution obtained in step 3 was made into a polyimide film with a thickness of 25 μm.

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Abstract

The invention discloses a colorless and transparent low dielectric constant polyimide film and a preparation method thereof. The polyimide film is characterized by obtaining a polyamide acid solution through polycondensation reaction between fluorinated diamine and a fluorinated dianhydride monomer and casting the polyamide acid solution to prepare the polyimide film. The polyimide film and the preparation method have the beneficial effects that the polyimide film is prepared by adopting fluorinated diamine and the dianhydride monomer and is colorless and transparent; the dielectric constant of the polyimide film is substantially reduced by introducing the fluorinated monomer; the process is simple and achieves industrial production very easily.

Description

technical field [0001] The invention belongs to the field of polymer materials, and relates to a polyimide material, in particular to a colorless transparent polyimide film with low dielectric constant and a preparation method thereof. Background technique [0002] With the development of ultra-large-scale integrated circuits, the integration of electronic devices is getting higher and higher, and the feature size is shrinking, so higher requirements are placed on circuit dielectric materials-high temperature resistance and low dielectric constant. Polyimide is widely used in the microelectronics industry due to its outstanding high and low temperature resistance and dielectric properties, such as chip packaging materials, shielding materials, and substrate materials for flexible printed circuit boards. At the same time, due to the excellent high and low temperature resistance and chemical stability of polyimide, it is also often used as a flexible substrate material for fil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/12C08J5/18
CPCC08G73/123C08J5/18C08J2379/08
Inventor 刘顺祯吕亮宋艳江
Owner WUXI SHUNXUAN NEW MATERIALS
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