Silicon rod cutter and cutting method

Abstract

The invention discloses a silicon rod cutter and a cutting method. The silicon rod cutter comprises a feeder device, a cutting device, a silicon rod conveyor table, an axis adjusting mechanism and a plurality of wire cutting units, wherein the feeder device is used for conveying a to-be-cut silicon rod to a to-be-loaded region; the cutting device is connected to the feeder device for performing a cutting operation on the to-be-cut silicon rod which is conveyed from the to-be-loaded region by the feeder device; the cutting device comprises a base; the silicon rod conveyor table is arranged on the base for carrying the to-be-cut silicon rod and driving the silicon rod to be conveyed along the axial direction of the silicon rod; the axis adjusting mechanism is arranged on the silicon rod conveyor table for adjusting the axis of the silicon rod to a horizontal state; and the plurality of wire cutting units are arranged on the base and are arranged above the silicon conveyor table in a liftable manner for cutting the to-be-cut silicon rod into a plurality of silicon rod sections. The to-be-cut silicon rod is conveyed to the to-be-loaded region through the feeder device, the plurality of wire cutting units can cut the to-be-cut silicon rod into the plurality of sections simultaneously, and the plurality of the silicon rod sections are removed from the silicon rod conveyor table to a material receiving table to be sequentially unloaded.

Description

technical field [0001] The invention relates to the technical field of silicon rod cutting, in particular to a silicon rod cutting machine and a cutting method. Background technique [0002] Silicon rod cutting technology is a relatively advanced square extraction processing technology in the world at present. Its principle is to rub the workpiece (such as silicon rod, sapphire, or other semiconductor hard and brittle materials) through high-speed moving diamond wire, and cut out the square. Ingot, so as to achieve the purpose of cutting. During the cutting process of the workpiece, the diamond wire is guided by the guide wheel to form a wire net on the main wire roller, and the workpiece to be processed is fed by the rise and fall of the worktable. Under the action of the pressure pump, the assembly The cooling water automatic spraying device on the equipment sprays the cooling water to the cutting part of the diamond wire and the workpiece, and the reciprocating motion of...

AI Technical Summary

Problems solved by technology

[0003] However, there are still deficiencies in the current silicon rod cutting machine. For example, the current silicon rod cutting machine can only cut one object to be cut at a time.

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