Liquid cooling heat sink

Abstract

The invention relates to the technical field of cooling of a high-power component, in particular to a liquid cooling heat sink employing a liquid heat conduction medium to dissipate heat. The liquid cooling heat sink is characterized in that a heat sink (1) is formed by welding a metal plate a (4) and a metal plate b (7), wherein the metal plate a (4) is provided with a liquid inlet (2) and a liquid outlet (3), parallel passages (5) are arranged on the inner side of the metal plate a (4) and are communicated with one another to form a groove space (6), and parallel grooves (8) are formed in the inner side of the metal plate b (7) and are not communicated with one another. In the liquid cooling heat sink disclosed by the invention, the surface, in contact with a hot source, of the heat sink and a cooling surface are both horizontal smooth plane so as to fully expand a heat exchange area, and the internal passage of a liquid cooling cavity is designed to a snake shape to reduce the flow resistance of a liquid in a water cooling cavity. The material of the liquid cooling heat sink shall be selected from metal with favorable heat conduction performance, such as copper and aluminum. In the liquid cooling heat sink, on one side, opposite to the liquid inlet (2) and the liquid outlet (3), of the cooling surface, a heating component is pasted on the cooling surface by heat conduction silica gel.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of high-power electronic components, in particular to a liquid-cooled radiator that utilizes a liquid heat-conducting working fluid to dissipate heat. Background technique [0002] For semiconductor electronic components such as high-power LEDs, heat will be generated after power-on, and semiconductor components have their normal operating temperature range. If they work at high temperatures for a long time, they will cause irreversible functional decline, so they must be dissipated. Traditional heat dissipation methods include air natural convection cooling, forced air cooling and liquid cooling. Since the emergence of heat pipes, heat pipes have appeared for heat dissipation. For example, air natural convection cooling has low cost, but low heat dissipation efficiency. In a working environment with limited volume, the heat sink of this kind of radiator should not be too large, and the s...

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Problems solved by technology

For example, air natural convection cooling has low cost, but low heat dissipation efficiency. In a working environment with limited volume, the heat sink of this kind of radiator should not be too large, and the small space is not conducive to convective heat transfer, so its heat transfer effect will be greatly reduced, thereby limiting its scope of use; while the heat pipe utilizes fluid principles such as capillary action, which has a good cooling effect, has extremely high thermal conductivity, good isothermal property, and the heat transfer area on both sides of the cold and hot sides can be It has the characteristics of arbitrary change, long-distance heat transfer, and temperature control, but the heat pipe is only applicable within a certain temperature range, and the relative cost is relatively high

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