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Rare-earth resistance paste of medium- and low-resistance high-power thick film circuit and preparation method of rare-earth resistance paste

A technology of thick film circuit and resistance paste, which is applied in the direction of circuit, conductive material dispersed in non-conductive inorganic materials, cable/conductor manufacturing, etc. Difficult design, large size and other problems, to achieve the effect of excellent printing and firing characteristics, low square resistance, and adjustable temperature coefficient of resistance

Inactive Publication Date: 2016-07-27
DONGGUAN COREHELM ELECTRONICS MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, high-power resistors (>100W-1000W), high-power electric heating elements (>100W-1000W) and other widely used components are generally made of wire-wound resistance wire, which has the characteristics of large size, short life, heat Difficult to design and other characteristics, and it is becoming more and more difficult to meet the stringent requirements of miniaturization, high reliability and long life of various electrical appliances

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Embodiment 1, a rare-earth resistor paste for high-power thick-film circuits in the middle and low resistance segment, including the following materials by weight, specifically:

[0034] Function phase 70%

[0035] Inorganic binder phase 15%

[0036] Zinc powder 2.5%

[0037] Organic carrier 12.5%;

[0038] The functional phase is a composite powder composed of nano-silver powder and ruthenium dioxide powder. The parts by weight of powder two kinds of materials are successively 95%, 5%;

[0039] The inorganic bonding phase is lead-free glass-ceramic powder, which is composed of SiO 2 , CaO, B 2 o 3 、A1 2 o 3 、 Bi 2 o 3 , CeO 2 、TiO 2 The mixture composed of SiO in the inorganic binder phase 2 , CaO, B 2 o 3 、A1 2 o 3 、 Bi 2 o 3 , CeO 2 、TiO 2 The parts by weight of the seven materials are 40%, 15%, 15%, 12%, 13%, 2.5%, 2.5%;

[0040] The organic carrier is a mixture composed of terpineol, ethyl cellulose, triamine citrate, polydimethylsiloxane and ...

Embodiment 2

[0052] Embodiment 2, a rare-earth resistor paste for high-power thick-film circuits in the middle and low resistance segment, including the following materials by weight, specifically:

[0053] Function phase 70%

[0054] Inorganic binder phase 15%

[0055] Zinc powder 1%

[0056] Organic carrier 14%;

[0057]The functional phase is a composite powder composed of nano-silver powder and ruthenium dioxide powder. The parts by weight of powder two kinds of materials are successively 96%, 4%;

[0058] The inorganic bonding phase is lead-free glass-ceramic powder, which is composed of SiO 2 , CaO, B 2 o 3 、A1 2 o 3 、 Bi 2 o 3 、Sm 2 o 3 , ZrO 2 The mixture composed of SiO in the inorganic binder phase 2 , CaO, B 2 o 3 、A1 2 o 3 、 Bi 2 o 3 、Sm 2 o 3 , ZrO 2 The parts by weight of the seven materials are 45%, 12%, 13%, 14%, 11%, 3%, 2%;

[0059] The organic carrier is a mixture composed of N-methylpyrrolidone, polyvinylpyrrolidone, polymethacrylamide, polydimet...

Embodiment 3

[0071] Embodiment 3, a rare-earth resistor slurry for high-power thick-film circuits in the middle and low resistance segment, including the following materials by weight, specifically:

[0072] Function phase 70%

[0073] Inorganic binder phase 15%

[0074] Aluminum powder 2.5%

[0075] Organic carrier 12.5%;

[0076] The functional phase is a composite powder composed of nano-silver powder and ruthenium dioxide powder. The parts by weight of powder two kinds of materials are successively 97%, 3%;

[0077] The inorganic bonding phase is lead-free glass-ceramic powder, which is composed of SiO 2 , CaO, B 2 o 3 、A1 2 o 3 、 Bi 2 o 3 、Gd 2 o 3 ,P 2 o 5 The mixture composed of SiO in the inorganic binder phase 2 , CaO, B 2 o 3 、A1 2 o 3 、 Bi 2 o 3 、Gd 2 o 3 ,P 2 o 5 The parts by weight of the seven materials are 55%, 10%, 10%, 10%, 10%, 2.5%, 2.5%;

[0078] The organic carrier is a mixture composed of N-methylpyrrolidone, polyvinylpyrrolidone, 1,4-dihydro...

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Abstract

The invention discloses a rare-earth resistor slurry for high-power thick-film circuits in the medium-low resistance section and a preparation method thereof. The rare-earth resistor slurry for high-power thick-film circuits in the medium-low resistance section includes a functional phase, an inorganic bonding phase, and a sintering accelerator , organic carrier, the functional phase is composed of nano-silver powder and ruthenium dioxide powder, and the inorganic bonding phase is composed of SiO 2 , CaO, B 2 o 3 、A1 2 o 3 、 Bi 2 o 3 , rare earth oxides, and crystal nucleating agents; the organic carrier is composed of organic solvents, polymer thickeners, dispersants, defoamers, and thixotropic agents; Low and adjustable, low and adjustable resistance temperature coefficient, excellent printing and firing characteristics, and can match the insulated stainless steel substrate. The process steps of the preparation method are the preparation of the inorganic bonding phase, the preparation of the functional phase, the preparation of the organic carrier, and the preparation of the resistance slurry, and the preparation method can effectively produce and prepare the above-mentioned rare earth resistance slurry.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to a rare earth resistor slurry for medium and low resistance high-power thick-film circuits and a preparation method thereof. The medium-low resistance high-power thick-film circuit rare earth resistor slurry is based on a stainless steel substrate. Background technique [0002] In the field of electric heating, new heating elements require small size, high power, small thermal inertia, large surface thermal load, low power consumption, high thermal efficiency, fast thermal start, stable power, uniform stable field, good manufacturability, and self-controlled temperature of the body. , safe and reliable operation, long service life, and wide application range, so thick film heating elements are required. [0003] At present, thick film heating resistors are usually based on gold, silver, platinum, ruthenium dioxide and other precious metal powders or their oxides, addi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 高丽萍苏冠贤徐方星
Owner DONGGUAN COREHELM ELECTRONICS MATERIAL TECH CO LTD
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