A kind of preparation method of nickel-palladium gold-plated bonding wire on copper-based surface

A bonding wire and nickel-plating technology, which is applied in superimposed layer plating, metal material coating process, semiconductor/solid-state device manufacturing, etc., to achieve strong bonding force, increase yield and production efficiency, and high bonding force.

Active Publication Date: 2018-03-30
SHANDONG KEDADINGXIN ELECTRONICS TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The technical problem solved by the present invention is to provide a nickel-palladium-gold-plated copper-based bonding wire with high bonding force and strong bonding force, which facilitates the welding of the nickel-palladium-gold frame and has no deformation defects in the solder joints, and can prevent peeling and cracks in the subsequent wire drawing process.

Method used

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  • A kind of preparation method of nickel-palladium gold-plated bonding wire on copper-based surface
  • A kind of preparation method of nickel-palladium gold-plated bonding wire on copper-based surface
  • A kind of preparation method of nickel-palladium gold-plated bonding wire on copper-based surface

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Embodiment Construction

[0017] according to figure 1 As shown, the present invention relates to a nickel-palladium-gold-plated copper-based surface bonding wire, which includes a copper wire substrate 1, the outer surface of the copper wire substrate 1 is sequentially coated with a nickel-plated layer 2, a palladium-plated layer 3 and a gold-plated Layer 4, the thickness of the nickel-plated layer (2) of the nickel-plated palladium-gold bonding wire on the surface after plating is 0.05 μm-0.1 μm, the thickness of the palladium-plated layer (3) is 2 μm-4.0 μm, and the thickness of the gold-plated layer (4) 0.05 μm~0.1 μm; the copper wire substrate 1 plated with the nickel-plated layer 2, the palladium-plated layer 3 and the gold-plated layer 4 is stretched to form a nickel-palladium-gold bonding wire with a diameter of 15~50 μm on the surface; due to The bonding force between copper and nickel is very good. Since the nickel-plated palladium-gold bonding wire on the surface does not need to perform int...

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Abstract

The invention relates to a copper-based nickel-palladium-gold-plated bonding wire and a preparation method thereof, which comprises a copper wire substrate (1), and the outer surface of the copper wire substrate (1) is sequentially coated with a nickel-plated layer (2) , a palladium-plated layer (3) and a gold-plated layer (4); the bonding force is high, the bonding force is strong, the welding of the nickel-palladium-gold frame is convenient, and the solder joints have no deformation defects, which can prevent peeling and cracking in the subsequent wire drawing process.

Description

technical field [0001] The invention relates to a nickel-palladium-gold-plated bonding wire on a copper-based surface and a preparation method thereof. Background technique [0002] For the selection of bonding wire substitute materials for current semiconductor packaging, the market mainly chooses palladium-plated copper wire. Palladium-coated copper wire has high electrical and thermal conductivity and creates a more reliable intermetallic bonding layer, resulting in product reliability advantages in high temperature environments. Compared with gold wire, it has a higher Young's modulus, so copper-plated wire has better wire arc characteristics. However, due to the weak binding force between palladium and copper, missing plating or falling off is easy to occur, which brings quality problems to subsequent drawing. Nickel and copper have a good bonding force, and palladium and nickel have a high bonding force. The outer layer of gold plating solves the problem of poor plas...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/49H01L21/48C22C9/00C23C28/02
CPCC22C9/00C23C28/023H01L21/4889H01L23/49H01L24/45H01L2224/4321H01L2224/45573H01L2224/45H01L2224/45644H01L2224/45655H01L2224/45147H01L2224/45664H01L24/43H01L2224/43848H01L2924/00012H01L2924/01024H01L2924/01057H01L2924/01058H01L2924/01206
Inventor 李天祥
Owner SHANDONG KEDADINGXIN ELECTRONICS TECH
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