Nanometer silver line circuit spray printing system and technology

Abstract

The invention relates to the spray printing technology field and particularly relates to a nanometer silver line circuit spray printing system and a technology. The nanometer silver line circuit spray printing system comprises a control processing system, a nozzle, a camera, a conveyer, a shifting device, a driving device, a sintering device and a base table. The nozzle adopts a single-nozzle micro-control spray printing mode and utilizes a voice coil motor to control piston motion inside the nozzle to spray out the nanometer silver line printing ink inside the cavity. The single-nozzle micro-control spray printing mode utilizes the voice coil motor to fast and precisely control the stroke of the piston so as to accurately control the spray printing ink quantity while guaranteeing the speed. In the meantime, the dismountable single-nozzle structure is adopted, which provides convenience to maintenance of the nozzle, and avoids the maintenance difficulty of adopting the normal nozzle under the condition of the circuit spray printing where the requirement for the nozzle state is high.

Description

technical field [0001] The invention relates to the technical field of jet printing, in particular to a nano silver wire circuit jet printing system and process. Background technique [0002] Nano-silver wire circuit forming technology is a circuit forming technology based on additive process that has emerged in recent years. Compared with the traditional subtractive process based on etching, it has fewer processes, high precision, flexibility, environmental protection, advantages such as savings. [0003] The existing nano-silver wire circuit forming technology is mainly divided into two types: screen printing and spray printing. The screen printing technology needs to use the screen as the medium, which needs to be produced and stored in advance, and the screen will be deformed due to stress and deformation due to environmental changes during the storage process. , especially the formation of fine circuits will have an impact on the accuracy. At the same time, the silk sc...

AI Technical Summary

Problems solved by technology

[0003] The existing nano-silver wire circuit forming technology is mainly divided into two types: screen printing and spray printing. The screen printing technology needs to use the screen as the medium, which needs to be produced and stored in advance, and the screen will be deformed due to stress and deformation due to environmental changes during the storage process. , especially the formation of fine circuits will have an impact on the accuracy. At the same time, the silk screen technology cannot accurately control the amount of ink used, and the waste of ink is more serious. In addition, the thickness of the conductive layer of the circuit formed by silk screen printing is difficult to increase, so there are requirements for the thickness of the conductive layer. Circuit, its screen printing effect is not ideal; for jet printing technology, because it does not need screen as a medium, it reduces the intermediate process and consumption, it can control the amount of ink according to the need, so that the conductive layer of jet printing can reach the required thickness and width , which improves the printing effect, but the circuit printing has high requirements on the state of the nozzle, and it is necessary to ensure that the nozzle cannot be blocked, otherwise there will be a disconnection phenomenon, which will lead to the disconnection of the printing circuit. However, the current circuit printing basically adopts mature industrial Or commercial nozzles for printing, the nozzle array structure is generally relatively fine, and it will be difficult to ensure the smoothness of each nozzle after a long time of use, which brings greater difficulty to maintenance work. At present, circuit printing mostly uses dislocation and repeated printing The way to prevent possible disconnection phenomenon reduces the efficiency of printing, and because the existing nozzle adopts an integrated structure, when there are many nozzles blocked by the nozzle, only the entire nozzle can only be replaced

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