High-performance pore filling and copper plating solution

Abstract

The invention provides a high-performance pore filling and copper plating solution which comprises a basic solution and a copper plating additive. The basic solution is copper methane sulfonate and methanesulfonic acid, and the copper plating additive is a macromolecule polymer prepared from an organic amine monomer, chloropropene, sulfur dioxide and the like through a polymerization reaction. Compared with the prior art, helium atoms and sulfur dioxide groups are creatively introduced into the amine monomer, and the novel high-performance copper plating additive is formed through polymerization. On the one hand, the unitary copper plating additive is applied to pore filling electroplating, production and control are easy, and therefore the pore filling and copper plating production efficiency is effectively improved; on the other hand, due to the fact that the unitary electroplating additive is combined with the copper methane sulfonate and methanesulfonic acid system, tolerance to organic carbon is high, the solution service life is long, the additive is small in dosage and small in consumption, and copper plating quality is greatly improved.

Description

Technical field [0001] The invention relates to a high-performance hole filling electroplating solution for printed circuit boards and integrated circuit packaging substrates. Background technique [0002] Electroplating is an important process in the production process of printed circuit boards (PCB, PrintedCircuitBoard) and integrated circuit packaging substrates (ICsubstrate). It uses electrolysis to make metals realize interlayer interconnection under the action of electrodeposition. At present, with the increasing degree of integration of electronic components and increasing power, it is becoming more and more common to realize inter-layer interconnection in the form of full copper filling. [0003] However, usually all copper-filled copper plating solutions use a ternary copper plating additive system, and usually ternary copper plating additives are called accelerators, wetting agents, and leveling agents. Using the interaction between the three to realize the full copper f...

AI Technical Summary

Problems solved by technology

Using the interaction between the three to realize the full copper filling of blind holes, the ternary additives can adjust their respective compositions, which is flexible and convenient, but the control is complicated, it is easy to lose sight of the other, and there is mutual influence between them, so the current application is not good. widely

In addition, because the ternary system is usually only suitable for basic solution systems such as copper sulfate-sulfuric acid, the system has a small tolerance to organic carbon, and the ternary system copper plating additive itself has a high organic carbon content, which leads to the ternary copper plating additive The process window of the copper plating solution of the system is narrow, the service life is short, and it is prone to aging and failure

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