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Sandwich tablet sample preparing die for epoxy resin and method

An epoxy resin and sample-making mold technology, applied in the direction of coating, etc., can solve the problems of different colors on the upper and lower surfaces, high viscosity of liquid epoxy resin, and can not guarantee absolute dust-free, etc., to achieve low mold cost, uniform thickness, The effect of meeting the relative thickness error accuracy requirements

Inactive Publication Date: 2016-06-15
HARBIN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The difference in heat transfer material and oxidation degree leads to the phenomenon that the color of the upper and lower surfaces of the prepared samples is prone to be different
May have some influence on the measurement
[0006] 4. Due to the relatively high viscosity of liquid epoxy resin and the pouring of thinner samples under the action of surface tension, the pouring and leveling process of this process is more difficult
However, the actual medium temperature box cannot be guaranteed to be absolutely dust-free, which may cause some impurities to fall into the sample and be cured into the sample during the curing process, resulting in defects in the prepared sample

Method used

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  • Sandwich tablet sample preparing die for epoxy resin and method
  • Sandwich tablet sample preparing die for epoxy resin and method
  • Sandwich tablet sample preparing die for epoxy resin and method

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Experimental program
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specific Embodiment approach 1

[0033] Specific implementation mode one: as Figure 3-5 As shown, the epoxy resin sandwich sample preparation mold provided by this embodiment is aligned and stacked sequentially from bottom to top by the bottom mirror panel 1, the bottom film 2, the intermediate thickness interlayer 3, the upper film 4 and the upper mirror panel 5 A cavity 6 is provided in the middle of the intermediate thickness interlayer 3 .

[0034] In this embodiment, the bottom mirror panel 1 and the upper mirror panel 5 are both mirror stainless steel plates.

[0035] In this embodiment, the bottom film 2 and the top film 4 are double-sided silicone oil PET transparent release films.

[0036] In this embodiment, the thickness of the middle constant thickness interlayer 3 is 0.2-1 mm.

[0037] In this embodiment, the cross section of the mold cavity 6 can be processed into any shape according to actual needs, such as ellipse, square, circle, dumbbell and so on.

specific Embodiment approach 2

[0038] Specific implementation mode two: this implementation mode takes E51 epoxy resin as an example, and provides a kind of sandwich pressing method for sample preparation of epoxy resin, such as Figure 6 and 7 As shown, the specific steps are as follows:

[0039] 1. Put 50g of E-51 epoxy resin matrix into a vacuum drying oven and preheat it at 70°C for 30 minutes to reduce its viscosity.

[0040] 2. Take out the preheated epoxy resin matrix and add 40g of methyl hexahydrophthalic anhydride curing agent and 0.5g of imidazole accelerator.

[0041] 3. Put the mixture in a constant temperature oil bath at 70°C, and stir with an electric stirrer for 30 minutes to mix the curing agent and the epoxy matrix evenly.

[0042] 4. Put the mixed solution into a vacuum drying oven to vacuumize, stir and exhaust for two hours, until no bubbles are precipitated.

[0043] 5. First put the bottom PET film on the bottom mirror stainless steel plate, and then put the middle fixed-thickness...

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Abstract

The invention discloses a sandwich pressing sample preparation mold and method for epoxy resin. The sample preparation mold is formed by aligning and stacking a bottom mirror panel, a bottom film, a middle thickness-calibrating mold, an upper film and an upper mirror panel , a cavity is provided in the middle of the intermediate thickness interlayer. Described sample preparation method is as follows: one, the base film is placed on the base mirror panel, and then the intermediate thickness interlayer is placed on the base film; Two, inject epoxy resin in the mold cavity of the intermediate thickness interlayer with a syringe; 1. Cover the upper layer of film, and gradually cover it from one side to the other during the process of covering the film. If there are air bubbles, drive the air bubbles to the edge of the mold to get rid of them; 4. Cover the upper mirror panel; Slowly put it on the preheated flat vulcanizer for pressurized time-sharing solidification, and after it cools down naturally, demould and take out the sample. The samples prepared by the invention have high quality and uniform thickness, and samples with any thickness can be prepared, which greatly reduces the interference factors in the measurement process.

Description

technical field [0001] The invention belongs to the technical field of high-voltage insulating materials, and relates to a brand-new epoxy resin sample manufacturing device and process. Background technique [0002] At present, the sample production process of epoxy resin is mainly pouring method. First, a certain volume of mixed epoxy resin is poured into the preheated steel mold, and then the liquid covers the entire mold by adjusting the angle of the mold or draining it with a glass rod. , and finally placed on the horizontal platform in the oven for time-sharing heating and curing, the process flow is as follows figure 1 and 2 shown. The main disadvantages of this process are as follows: [0003] 1. Limited by the mold processing technology and the surface tension of the liquid, this method is relatively weak in the controllability of the thickness of the poured sample, and it cannot manufacture samples of arbitrary thickness (especially samples with a thickness less ...

Claims

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Application Information

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IPC IPC(8): B29C45/26B29C45/14
CPCB29C45/26B29C45/14467B29C2045/14532
Inventor 陈庆国王新宇杨洪达
Owner HARBIN UNIV OF SCI & TECH
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