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Gripping device for conveying wafer carrying discs

A technology for grabbing devices and discs, which is applied in the direction of gaseous chemical plating, metal material coating process, coating, etc., can solve the problems of insufficient stability and safety, low efficiency, inconvenient operation, etc., and achieve simple and reliable structure , stable and safe operation, uniform force in the circumferential direction

Active Publication Date: 2016-06-01
广东众元半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the operation of existing CVD equipment, most of the CVD technicians use the gloves of the glove box to pick and place the slide tray. The operation is inconvenient, not stable and safe enough, and it is highly dependent on the operating proficiency of the personnel, and the efficiency Low; in the equipment of some manufacturers, such as the multi-chamber metal-organic chemical vapor deposition (MOCVD) equipment of American Veeco, the tray-type manipulator is used to transfer and transport the loading plate, which greatly improves the production efficiency, but the structure of the tray-type manipulator is complicated and cannot be used. Uniform force in the circumferential direction of the loading plate

Method used

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  • Gripping device for conveying wafer carrying discs
  • Gripping device for conveying wafer carrying discs
  • Gripping device for conveying wafer carrying discs

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Embodiment Construction

[0014] Embodiments of the present invention are further described below in conjunction with the accompanying drawings, Figure 1 to Figure 4 is a schematic illustration of the operation of an embodiment device according to the present invention. It should be understood that the disclosed Figure 1 to Figure 4 Emphasis is placed on illustrating components of devices according to embodiments of the present invention, that is, these figures are not intended to illustrate every single component of the device of the present invention.

[0015] Such as figure 1 , figure 2 , image 3 and Figure 4 As shown in the figure, a grabbing device for chemical vapor deposition equipment transporting the carrier tray mainly includes a base 1, a guide rod 2, a rotary arm 3, and a manipulator 4. The guide rod 2 is fixedly installed on the base 1, and the rotary arm 3 is installed On the guide rod 2, the end of the rotary arm 3 is equipped with a manipulator 4 for grabbing and placing the s...

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Abstract

The invention discloses a gripping device for conveying wafer carrying discs of chemical vapor deposition equipment. The gripping device mainly comprises a base, a guide rod, a rotation arm and a mechanical arm. According to the gripping device for conveying the wafer carrying discs, the circumferential stress of the wafer carrying discs is more uniform in the manner that the wafer carrying discs are evenly hoisted in the circumferential direction, stable conveying of the wafer carrying discs and wafers in the wafer carrying discs is guaranteed, and in addition, by means of reverse application of a swinging guide rod mechanism, the gripping and placing actions of the mechanical arm are achieved. The structure is simple and reliable, operation is more stable and safer compared with manual operation, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the field of semiconductor material manufacturing devices, in particular to a grabbing device used for conveying a carrier disc of a chemical vapor deposition device. Background technique [0002] Chemical vapor deposition (CVD) technology integrates precision machinery, semiconductor materials, vacuum electronics, fluid mechanics, optics, chemistry, and computer disciplines. It is a high-end semiconductor material with high automation, high price and high technology integration. Special equipment for device manufacturing. As an ideal method for the epitaxial growth of compound semiconductor materials, chemical vapor deposition equipment has the characteristics of high quality, good stability, good repeatability, flexible process, and large-scale mass production. It has become the key core for the production of semiconductor optoelectronic devices and microwave devices in the industry. The equipment has broad application prosp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/458
Inventor 许福海王亮王明星甘志银
Owner 广东众元半导体科技有限公司
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