Clean micro-charging technology suitable for MEMS micro thruster array chip

Abstract

The invention provides a clean micro-charging technology suitable for an MEMS micro thruster array chip. The technology includes the following steps that firstly, according to the diameter and distribution of a micro-chemical chamber array layer, corresponding partition board micro through holes are machined in partition boards of an array with micro pores, and the partition boards of the array with the micro pores are fixed to the surface of the micro-chemical chamber array layer; secondly, a micro-chemical chamber is filled with propellant energy-containing materials; thirdly, the partition boards of the array with the micro pores on the upper surface of the micro-chemical chamber array layer are removed, and a clean technological face, protected by the partition boards of the array with the micro pores, of the micro-chemical chamber array layer is exposed; fourthly, the subsequent bonding step is conducted, and the cleanliness of the surface of the micro-chemical chamber array layer is guaranteed. The method has the advantages that material adaptability is wide; the micro-porous array on the partition boards can be machined through the MEMS technology, and precision and efficiency are high; high-precision positioning marks can be conveniently machined in the partition boards, it can be guaranteed that the micro-porous array of the partition boards and a micro-chemical chamber array are concentric in the vertical direction through the alignment technology, and it is guaranteed that the micro-charging process is smoothly completed.

Description

Technical field [0001] The invention relates to the technical field of micro-thruster array chips based on MEMS technology, in particular to the technology of MEMS micro-thruster array chips that are filled with propellant and other energetic materials in a micro-drug chamber array to generate micro-thrust / micro-impulse field. Background technique [0002] At present, MEMS micro-thruster array chip technology is a powerful competitive technology that meets the needs of micro-spacecraft attitude and orbit control represented by micro-satellites and micro-satellite constellations. With the advancement of MEMS technology, the diameter of the micro-chamber of the MEMS micro-thruster array chip has entered the sub-millimeter scale, ensuring that the high-density micro-chamber array layer is clean after the micro-charge is completed. One of the key technologies for the successful bonding of the micro-jet hole array layer and the improvement of the bonding performance. So far, most of...

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Problems solved by technology

[0004] The present invention proposes a clean micropowdering process suitable for MEMS microthruster array chips, and its purpose is to improve the cleanness between the micropowder chamber array layer and the microjet hole array layer during the processing of MEMS microthruster array chips. Excellent bonding efficiency and bonding performance; solve the technical problems that plague the preparation and performance of MEMS micro-thruster array chips in the prior art and affect the low bonding efficiency and bonding strength of the micro-chamber array layer and the micro-jet array layer, etc. craft problem

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